High-speed CAN/LIN fail-safe system basis chip

High-speed CAN/LIN fail-safe system basis chip

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高速CAN/LIN故障安全系统基础芯片

封装/外壳：32-TSSOP（0.240"，6.10mm 宽）裸露焊盘 包装：卷带（TR） 描述：IC INTFACE SPECIALIZED 32HTSSOP 集成电路（IC） 专用

封装/外壳：32-TSSOP（0.240"，6.10mm 宽）裸露焊盘 包装：卷带（TR） 描述：IC INTFACE SPECIALIZED 32HTSSOP 集成电路（IC） 专用

Customer Specification

Construction Diameters (In) 1) Component 1 5 X 1 COND a) Conductor 16 (19/.0117) AWG Tinned Copper 0.059 b) Insulation 0.032 Wall, Nom. PVC 0.123 (1) Color Code Alpha Wire Color Code F Cond Color Cond Color Cond Color 1 BLACK 3 RED 5 ORANGE 2 WHITE 4 GREEN 2) Cable Assembly 5 Components C

Customer Specification

Construction Diameters (In) 1) Component 1 5 X 1 COND a) Conductor 16 (19/.0117) AWG Tinned Copper 0.059 b) Insulation 0.032 Wall, Nom. PVC 0.123 (1) Color Code Alpha Wire Color Code F Cond Color Cond Color Cond Color 1 BLACK 3 RED 5 ORANGE 2 WHITE 4 GREEN 2) Cable Assembly 5 Components C

Heyco® Liquid Tight Strain Relief Bushings

The Ultimate in Snap-In Strain Relief Protection Snap-in, Low Profile Design allows for Pre-assembled Cables • These low profile co-molded nylon and elastomer parts function as a Liquid Tight Strain Relief with a cable. • cULus approved under UL 514B. • Low profile design: height above pan

IEC Appliance Inlet C18 with Fuseholder 1-pole

文件：406.06 Kbytes Page：3 Pages

IEC Appliance Inlet C18 with Fuseholder 1-pole

文件：390.11 Kbytes Page：3 Pages