Surface Mount Ultrafast Rectifier

FEATURES • Low profile package • Ideal for automated placement • Oxide planar chip junction • Ultrafast recovery times for high frequency • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • Solder dip 260 °C, 40 s • Compliant to RoHS directive 2002/95/EC and in acc

Surface Mount Ultrafast Plastic Rectifier

FEATURES • Glass passivated pellet chip junction • Ideal for automated placement • Ultrafast recovery times for high efficiency • Low forward voltage, low power losses • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • AEC-Q101 qualified availabl

Surface Mount Ultrafast Plastic Rectifiers

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Surface Mount Ultrafast Plastic Rectifier

文件：105.3 Kbytes Page：4 Pages