位置：首页 > IC中文资料 > UGF18DCTHE3SLASH45
| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
UGF18DCTHE3SLASH45 | Dual Common-Cathode Ultrafast Plastic Rectifier FEATURES • Power pack • Glass passivated pellet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low forward voltage drop • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 275 ° | VishayVishay Siliconix 威世 |   | |
UGF18DCTHE3SLASH45 | Dual Common Cathode Ultrafast Plastic Rectifier • Power pack • Glass passivated pallet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low forward voltage drop • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 275 °C max., 1 | VishayVishay Siliconix 威世 | | |
Dual Common-Cathode Ultrafast Plastic Rectifier FEATURES • Power pack • Glass passivated pellet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low forward voltage drop • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 275 ° | VishayVishay Siliconix 威世 | | ||
Dual Common Cathode Ultrafast Plastic Rectifier • Power pack • Glass passivated pallet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low forward voltage drop • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 275 °C max., 1 | VishayVishay Siliconix 威世 | | ||
Dual Common-Cathode Ultrafast Plastic Rectifier FEATURES • Power pack • Glass passivated pellet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low forward voltage drop • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 275 ° | VishayVishay Siliconix 威世 | | ||
Dual Common Cathode Ultrafast Plastic Rectifier • Power pack • Glass passivated pallet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low forward voltage drop • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 275 °C max., 1 | VishayVishay Siliconix 威世 | |
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TSC原装 |
25+23+ |
TO-220F |
22723 |
绝对原装正品全新进口深圳现货 |
|||
CREE/科锐 |
23+ |
TO-59 |
8510 |
原装正品代理渠道价格优势 |
|||
CREE |
2450+ |
SMD |
9850 |
只做原厂原装正品现货或订货假一赔十! |
|||
CREE/科锐 |
23+ |
11200 |
原厂授权一级代理、全球订货优势渠道、可提供一站式BO |
||||
cree |
23+ |
高频管 |
750 |
专营高频管模块,全新原装! |
|||
TSC America Inc. |
22+ |
9000 |
原厂渠道,现货配单 |
||||
TSC原装 |
24+ |
TO-220F |
30980 |
原装现货/放心购买 |
|||
CREE/科锐 |
24+ |
280 |
现货供应 |
||||
Taiwan Semiconductor Corporati |
25+ |
TO-220-3 全封装 隔离接片 |
9350 |
独立分销商 公司只做原装 诚心经营 免费试样正品保证 |
|||
TAIWAN |
25+ |
TO-220 |
3675 |
就找我吧!--邀您体验愉快问购元件! |
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UGF18DCTHE3SLASH45规格书下载地址
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