Ultrafast Rectifier

FEATURES • Oxide planar chip junction • Ultrafast recovery time • Low switching losses, high efficiency • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 260 °C, 40 s (for TO-220AC and ITO-220AC package) • Compl

Ultrafast Rectifier

文件：138 Kbytes Page：5 Pages

Ultrafast Rectifier

FEATURES • Oxide planar chip junction • Ultrafast recovery time • Low switching losses, high efficiency • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 260 °C, 40 s (for TO-220AC and ITO-220AC package) • Compl

Ultrafast Rectifier

FEATURES • Oxide planar chip junction • Ultrafast recovery time • Low switching losses, high efficiency • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 260 °C, 40 s (for TO-220AC and ITO-220AC package) • Compl

封装/外壳：TO-263-3，D²Pak（2 引线 + 接片），TO-263AB 包装：管件 描述：DIODE GEN PURP 200V 8A TO263AB 分立半导体产品 二极管 - 整流器 - 单

DIODE GEN PURP 200V 8A TO263AB

Ultrafast Rectifier

文件：138 Kbytes Page：5 Pages