Applications

Mobile Equipment

Smartphones

Tablets

Notebook PCs

Desktop PCs

Features

(1) Suitable for use with a 3.3 V signal line. (VRWM ≤ 3.3 V)

(2) Protects devices with its high ESD performance.

(VESD = ±20 kV (Contact / Air) @IEC61000-4-2)

(3) Low dynamic resistance protects semiconductor devices from static electricity and noise.

(RDYN = 0.3 Ω (typ.))

(4) Snapback characteristics realizing low clamping voltage protects semiconductor devices.

(VC = 7.8 V@IPP = 2.5 A (typ.))

(5) Compact package is suitable for use in high density board layouts such as in mobile devices.

(1.0 mm × 0.6 mm size (Nickname: CST2))