1 Features

Wireless MCU processing elements

• Arm® Cortex®-M33 processor (96MHz) with FPU

(floating point unit), TrustZone®-M support, and

CDE (custom datapath extension) for machine

learning acceleration

• Algorithm Processing Unit (APU) (96MHz)

– Mathematical accelerator for efficient vector

and matrix operations

– Bluetooth® Channel Sounding post-processing

support for IFFT and advanced superresolution

algorithms such as MUltiple SIgnal

Classification (MUSIC)

Wireless MCU memory

• Up to 1MB of in-system programmable flash

• Up to 162KB of SRAM

• 32KB of System ROM with secure boot root of

trust (RoT) and a serial (SPI/UART) bootloader

• Serial wire debug (SWD)

Qualified for automotive application

• AEC-Q100 Grade 2 qualified:

– –40°C to +125°C junction temperature

• HBM ESD Classification Level 2 (ESD HBM level

1C on RF pin, per AEC-Q100 Rev. J)

• CDM ESD Classification Level C2A (ESD CDM

level C1 on RF pin, per AEC-Q100 Rev. J)

MCU peripherals

• 23 GPIOs, digital peripherals can be routed to

multiple GPIOs:

– Two SWD IO pads, multiplexed with GPIOs

– Two LFXT IO pads, multiplexed with GPIOs

– 19 DIOs (analog or digital IOs)

• All GPIOs with wakeup and interrupt capabilities

• 3 × 16-bit and 1 × 32-bit general-purpose timers,

quadrature decode mode support

• Real-time clock (RTC)

• Watchdog timer

• System timer for radio, RTOS, and application

operations for Bluetooth® channel sounding

postprocessing

• 12-bit ADC, up to 1.2MSPS, eight external inputs

• Temperature sensor and battery monitor

• 1× low-power comparator

• 2× UART with LIN capability

• 2× SPI

• 1× I2C

• 1× I2S

• 1× CAN-FD controller with CAN/CAN-FD ISO

16845-1:2016 certification compliance

Security enablers

• ISO21434 Automotive Cybersecurity Compliant

• Hardware Security Module (HSM) with proprietary

controller and dedicated memories supporting

accelerated cryptographic operations and secure

key storage:

– AES (up to 256 bits) crypto accelerator

– ECC (up to 521 bits), RSA (up to 3072 bits)

public key accelerator

– SHA-2 (up to 512 bits) accelerator

– True random number generator

– HSM firmware update support

– Differential power analysis (DPA)

countermeasures for AES and ECC

• Separate AES 128-bit cryptographic accelerator

(LAES) for latency-critical link-layer operations

• Secure boot and secure firmware updates

• Cortex®-M33 TrustZone-M, MPU, memory

firewalls for software isolation

• Voltage glitch monitor (VGM)

Low-power consumption (VDDS at 3.3V)

• On-chip buck DC/DC converter

• RX current: 6.1mA

• TX current at 0dBm: 7.7mA

• TX current at +10dBm: 24.5mA

• Active mode MCU 96MHz (CoreMark®): 6.8mA

• Standby: 0.9μA (low power mode, RTC on, full

SRAM retention)

• Shutdown: 160nA

Wireless protocol support

• Bluetooth® Low Energy 5.4

• Bluetooth® Low Energy 6.0 ready

– Support for Bluetooth® Channel Sounding (High

Accuracy Distance Measurement)

High-performance radio

• 2.4GHz RF transceiver compatible with Bluetooth®

Low Energy specification

• Output power up to +10dBm (R version)

• Output power up to +20dBm (P version)

• Integrated BALUN

• Integrated RF switch

• Receiver sensitivity:

– Bluetooth® LE 125kbps: –103.5dBm

– Bluetooth® LE 1Mbps: –97dBm

Regulatory compliance

• Designed for systems targeting compliance with

worldwide radio frequency regulations

– EN 300 328 (Europe)

– FCC CFR47 Part 15 (US)

– ARIB STD-T66 (Japan)

Development tools and software

• LP-EM-CC2745R10-Q1 LaunchPad™

Development Kit

• BP-EM-CS Multiple antenna board for Bluetooth®

Channel Sounding

• SimpleLink™ Low Power F3 Software

Development Kit (SDK)

– Fully qualified Bluetooth® software protocol

stack in the SDK

• Up to 32 concurrent multirole connections

• Bluetooth® Low Energy 5.4 Support

• CCC Digital Key 3 / ICCE Bluetooth® APIs

support for secure car access systems

• Automotive SPICE (ASPICE) compliance for SDK

components, including the Bluetooth® LE stack

• SysConfig system configuration tool

• SmartRF™ Studio for simple radio configuration

Operating ranges

• Junction temperature TJ: –40°C to 125°C

• Wide supply voltage range 1.71V to 3.8V

Package

• 6mm × 6mm QFN40 with wettable flanks

• RoHS-compliant package

2 Applications

• Automotive

– Car access and security systems

• Digital key

• Phone as a key (PaaK)

• Passive entry passive start (PEPS)

• Remote keyless entry (RKE)

3 Description

The SimpleLink™ CC274xR-Q1 and CC274xP-Q1 devices are AEC-Q100 complaint wireless microcontrollers

(MCUs) supporting Bluetooth® Low Energy 5.4 for automotive applications. These devices are optimized for

low-power wireless communication in applications such as car access, including passive entry passive start

(PEPS), phone as a key (PaaK), and remote keyless entry (RKE). The key features of this device include:

• Support for features in Bluetooth® 5.4 and earlier versions:

– LE Coded PHYs (Long Range), LE 2Mbit PHY (high speed), advertising extensions, multiple

advertisement sets, CSA#2, as well as backward compatibility with earlier Bluetooth® Low Energy

specifications

• Bluetooth® Channel Sounding technology support and Algorithm Processing Unit (APU) to enable high

accuracy, low cost, and secure phase-based ranging mechanism for distance estimation.

– APU enables latency and power-efficient execution of distance-ranging signal processing algorithms,

including FFT and super-resolution complex algorithms like MUltiple SIgnal Classification (MUSIC)

• Arm®Custom Data Extension (CDE) instruction support for machine learning acceleration

• Fully qualified Bluetooth® software protocol stack included with the SimpleLink™ Low Power F3 Software

Development Kit (SDK)

• Advanced security features for connected wireless MCUs:

– An isolated HSM environment with a dedicated controller handling accelerated cryptographic and random

number generation operations

– Secure boot and firmware updates with the root of trust enabled by an immutable system ROM

– Arm® Cortex M33 TrustZone-M based trusted execution environment support

– Secure key storage support with HSM and TrustZone-M

– Hardware fault sensors to mitigate low-cost, low-effort, non-invasive physical attack threats like voltage

glitch injection

– Dedicated AES-128 HW accelerator for handling timing-critical link-layer encryption/decryption operations

• Ultra-low standby current with full 162KB SRAM retention and RTC operation that enables significant battery

life extension, especially for applications with longer sleep intervals

• Extended temperature support with the lowest standby current

• Integrated BALUN and integrated RF switch to support both transmit and receive operations on the same RF

pin, even in the P version; thereby, enabling a reduced bill-of-material (BOM) board layout

• Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth® Low Energy