1 FEATURES

1• Integrates Synchronous Buck Driver and

NexFET™ Power MOSFETS for High Power

Density and High Efficiency

• 25-A Output Current Capability for DSP and ASIC

• 4.7-V to 14-V Input Voltage Range

• Operational up to 2 MHz Switching Frequency

• Built-In High-Side Current Protection

• DCR Current Sensing for Overcurrent Protection

and Output Current Monitoring

• Voltage Proportional to Load Current Monitor

Output

• Tri-state PWM Input for Power Stage Shutdown

• UVLO Housekeeping Circuit

• Integrated Thermal Shutdown

• 40-Pin, 5 mm x 7 mm, PQFN PowerStack™

Package

2 APPLICATIONS

• Digital or Analog POL Power Modules

• High Power Density DC-DC Converters for

Telecom and Networking Applications

3 DESCRIPTION

UCD74120 is a multi-chip module integrating a driver

device and two NexFET power MOSFETs into a

thermally enhanced compact, 5 mm × 7 mm, QFN

package. A 25-A output current capability makes the

device suitable for powering DSP and ASIC. The

device is designed to complement digital or analog

PWM controllers. The PWM input of the driver device

is 3-state compatible. Two driver circuits provide high

charge and discharge current for the high-side Nchannel

FET switch and the low-side N-channel FET

synchronous rectifier in a synchronous buck

converter.

Output current is measured and monitored by a

precision current sensing amplifier that processes the

voltage present across an external current sense

element. The amplified signal is available for use by

the PWM controller on the IMON pin. On-board

comparators monitor the voltage across the high-side

switch and the voltage across the external current

sense element to safeguard the power stage from

sudden high-current loads. Blanking delay is set for

the high-side comparator by a single resistor in order

to avoid false reports coincident with switching edge

noise. In the even of a high-side fault or an

overcurrent fault, the high-side FET is turned off and

the fault flag (FLT) is asserted to alert the PWM

controller.