位置:UC3706DW.A > UC3706DW.A详情

UC3706DW.A中文资料

厂家型号

UC3706DW.A

丝印代码

UC3706DW

封装外壳

SOIC

文件大小

318.78Kbytes

页面数量

11

功能描述

Dual Output Driver

数据手册

下载地址一下载地址二到原厂下载

生产厂商

TI2

UC3706DW.A数据手册规格书PDF详情

FEATURES

• Dual, 1.5A Totem Pole Outputs

• 40nsec Rise and Fall into 1000pF

• Parallel or Push-Pull Operation

• Single-Ended to Push-Pull Conversion

• High-Speed, Power MOSFET

Compatible

• Low Cross-Conduction Current Spike

• Analog, Latched Shutdown

• Internal Deadband Inhibit Circuit

• Low Quiescent Current

• 5 to 40V Operation

• Thermal Shutdown Protection

• 16-Pin Dual-In-Line Package

• 20-Pin Surface Mount Package

DESCRIPTION

The UC1706 family of output drivers are made with a high-speed

Schottky process to interface between low-level control functions and

high-power switching devices - particularly power MOSFET's. These devices

implement three generalized functions as outlined below.

First: They accept a single-ended, low-current digital input of either polarity

and process it to activate a pair of high-current, totem pole outputs

which can source or sink up to 1.5A each.

Second: They provide an optional single-ended to push-pull conversion

through the use of an internal flip-flop driven by double-pulsesuppression

logic. With the flip-flop disabled, the outputs work in parallel

for 3.0A capability.

Third: Protection functions are also included for pulse-by-pulse current

limiting, automatic deadband control, and thermal shutdown.

These devices are available in a two-watt plastic “bat-wing” DIP for operation

over a 0°C to 70°C temperature range and, with reduced power,

in a hermetically sealed cerdip for -55°C to +125°C operation. Also available

in surface mount Q and L packages.

更新时间:2026-7-30 10:19:00
供应商 型号 品牌 批号 封装 库存 备注 价格
UNIDEN
20+
QFP
500
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