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TXB0101DBVR.A中文资料

厂家型号

TXB0101DBVR.A

文件大小

2150.95Kbytes

页面数量

41

功能描述

TXB0101 1-Bit Bidirectional Level-Shifting and Voltage Translator With Auto Direction-Sensing and ±15kV ESD Protection

数据手册

下载地址一下载地址二到原厂下载

生产厂商

TI2

TXB0101DBVR.A数据手册规格书PDF详情

1 Features

• Available in the Texas Instruments NanoFree™

package

• 1.2V to 3.6V on A port and

1.65V to 5.5V on B port (VCCA ≤ VCCB)

• VCC isolation feature – if either VCC input is at

GND, all outputs are in the high-impedance state

• OE input circuit referenced to VCCA

• Low power consumption, 5μA maximum ICC

• Ioff supports partial-power-down mode operation

• Latch-up performance exceeds 100mA Per JESD

78, class II

• ESD protection Exceeds JESD 22

– A port

• 2000V Human body model (A114-B)

• 250V Machine model (A115-A)

• 1500V Charged-device model (C101)

– B port

• 15kV Human body model (A114-B)

• 250V Machine model (A115-A)

• 1500V Charged-device model (C101)

2 Applications

• Handsets

• Smartphones

• Tablets

• Desktop PCs

3 Description

This 1-bit noninverting translator uses two separate

configurable power-supply rails. The A port is

designed to track VCCA. VCCA accepts any supply

voltage from 1.2V to 3.6V. The B port is designed

to track VCCB. VCCB accepts any supply voltage from

1.65V to 5.5V. This allows for universal low-voltage

bidirectional translation between any of the 1.2V, 1.5V,

1.8V, 2.5V, 3.3V, and 5V voltage nodes. VCCA should

not exceed VCCB.

When the output-enable (OE) input is low, all outputs

are placed in the high-impedance state.

This device is fully specified for partial-power-down

applications using Ioff. The Ioff circuitry disables

the outputs, preventing damaging current backflow

through the device when it is powered down.

To ensure the high-impedance state during power up

or power down, OE should be tied to GND through a

pulldown resistor; the minimum value of the resistor

is determined by the current-sourcing capability of the

driver.

NanoFree™ package technology is a major

breakthrough in IC packaging concepts, using the die

as the package.

更新时间:2025-12-9 15:14:00
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