1 Features

1• TX7332 supports:

– 32-channel three-level pulser and active

transmit/receive (T/R) switch

– Very low power on-chip beamforming mode:

– In receive-only mode: 0.45 mW/ch

– In transmit-receive mode: 16.4 mW/ch

– In CW mode: 160 mW/ch

– In global power-down mode: 0.1 mW/ch

• Three-level pulser:

– Maximum output voltage: ±100 V

– Minimum output voltage: ±1 V

– Maximum output current: 1.2 A to 0.3 A

– Maximum clamp current: 0.5 A to 0.12 A

– Second harmonic : –45 dBc at 5 MHz

– CW mode jitter: 100 fs measured from 100 Hz

to 20 kHz

– CW mode close-in phase noise: -154 dBc/Hz

at 1 kHz offset for 5-MHz signal

– –3-dB bandwidth with 2-kΩ || 120-pF load

– 20 MHz (for ±100-V supply)

– 25 MHz (for ±70-V supply)

• Active T/R switch with:

– ON, OFF control signals

– Bandwidth: 50 MHz

– HD2: –50 dBc

– Turnon resistance: 24 Ω

– Turnon time: 0.5 μs

– Turnoff time: 1.75 μs

– Transient glitch: 50 mVPP

• Off-chip beamformer with:

– Jitter cleaning using synchronization feature

– Maximum synchronization clock frequency:

200 MHz

• On-chip beamformer with:

– Delay resolution: one beamformer clock period

– Maximum delay: 213 beamformer clock period

– Maximum beamformer clock speed: 200 MHz

– On-chip RAM to store

– 16 delay profiles

– 32 pattern profiles

• High-speed (100 MHz maximum) 1.8-V and 2.5-V

CMOS serial programming interface

• Automatic thermal shutdown

• No specific power sequencing requirement

• Small package: 260-pin NFBGA (17 mm × 11

mm) with 0.8-mm pitch

2 Applications

• Ultrasound imaging system

• Piezoelectric driver

• In-probe ultrasound imaging

3 Description

The TX7332 is a highly integrated, high-performance

transmitter solution for ultrasound imaging system.

The device has total 32 pulser circuits (PULS), 32

transmit/receive (T/R) switches, and supports both

on-chip and off-chip beamformer (TxBF). The device

also integrates on-chip floating power supplies that

reduce the number of required high voltage power

supplies.