1 Features

• AEC-Q100 qualified for automotive applications:

– Temperature grade 1: −40°C to +125°C, TA

• Wide input voltage range: 3V to 50V

• Low quiescent current: 40μA (typical)

• Low dropout voltage: 300mV (typical)

• Output current: 50mA

• No input protection diodes needed

• Adjustable output: From 1.275V to 28V

• Quiescent current in shutdown: 1μA

• Stable with 1μF output capacitor

• Stable with aluminum, tantalum, or ceramic

capacitors

• Reverse input-battery protection

• Reverse output current flow protection

• Thermal limiting

• Available in an 8-pin HVSSOP PowerPAD device

package

2 Applications

• Low-current, high-voltage regulators

• Regulators for battery-powered systems

• Telecom

• Automotives

3 Description

The TPS798-Q1 is the first device in a line of 50V

high-voltage micropower low-dropout (LDO) linear

regulators. This device is capable of supplying 50mA

output current with a dropout voltage of only 300mV.

Created for low quiescent current, high-voltage

(50V) applications, the 40μA operating and 1μA

quiescent current in shutdown makes the TPS798-

Q1 designed for battery-powered or high-voltage

systems. Quiescent current is also well-controlled in

dropout.

Other features of the TPS798-Q1 include the ability to

operate with low equivalent series resistance (ESR)

ceramic output capacitors. This device is stable

with only 1μF on the output; most older devices

require from 10μF to 100μF tantalum capacitors

for stability. Small ceramic capacitors can be used

without the necessary addition of ESR, as is

common with other regulators. Internal protection

circuitry includes reverse input-battery protection,

reverse output current protection, current limiting, and

thermal limiting to protect the device in various fault

conditions.

This device is available in a fixed output voltage of

5V (TPS79850) and with an adjustable output voltage

with a 1.275V reference voltage (TPS79801). The

TPS798-Q1 regulator is available in a 8-pin HVSSOP

PowerPAD (DGN) package with an exposed pad for

enhanced thermal management capability.