位置:TPS22925BYPHR > TPS22925BYPHR详情
TPS22925BYPHR中文资料
TPS22925BYPHR数据手册规格书PDF详情
1 Features
1• Input Voltage Range: 0.65 V to 3.6 V
• On-Resistance
– RON = 9.2 mΩ at VIN = 3.6 V
– RON = 9.2 mΩ at VIN = 1.8 V
– RON = 10.2 mΩ at VIN = 1 V
– RON = 13.1 mΩ at VIN = 0.65 V
• 3-A Maximum Continuous Switch Current
• Quiescent Current, IQ,VIN = 29 μA at VIN = 3.6 V
• Low Control Input Threshold Enables 1.5-, 1.8-,
2.5-, or 3.3-V Logic
• Controlled Slew Rate
– tR = 97 μs at VIN = 3.6 V (TPS22925Bx)
– tR = 810 μs at VIN = 3.6 V (TPS22925Cx)
• Reverse Current Blocking (When Disabled)
• Quick Output Discharge (QOD) (TPS22925B and
TPS22925C only)
• Wafer Chip Scale Package:
– 0.9 mm x 1.4 mm, 0.5-mm Pitch, 0.4-mm
Height
• ESD Performance Tested per JESD 22
– 2-kV HBM and 1-kV CDM
2 Applications
• Computing
• SSD
• Tablets
• Wearables
• EPOS
3 Description
The TPS22925 product family consists of four
devices: TPS22925B, TPS22925BN, TPS22925C,
and TPS22925CN. Each device is a 9-mΩ, singlechannel
load switch with a controlled slew rate.
The devices contain an N–channel MOSFET that can
operate over an input voltage range of 0.65 V to
3.6 V and can support a maximum continuous current
of 3 A. This continuous current enables the devices to
be used across multiple designs and end equipments.
Each of the TPS22925 devices provides reverse
current blocking when disabled allowing for power
supply protection and power multiplexing capabilities.
The controlled rise time for the device greatly reduces
inrush current caused by large bulk load
capacitances, thereby reducing or eliminating power
supply droop. When operating with an input voltage
of 3.6 V, the TPS22925Bx devices feature a 97 μs
rise time and the TPS22925Cx devices feature an
810 μs rise time.
The TPS22925 family of devices can help reduce the
total solution size by offering an optional integrated,
150-Ω pull–down resistor for quick output discharge
(QOD) when the switch is turned off. Each of the
TPS22925 devices is available in a 0.9 mm × 1.4
mm, 0.5-mm pitch, 0.4-mm height 6–pin wafer chip
scale package (WCSP) allowing for smaller, more
integrated designs. The WCSP and 9 mΩ of onresistance
allow use in space constrained, battery
powered applications. The device is characterized for
operation over the free–air temperature range of
–40°C to +105°C.
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
TI |
24+ |
DSBGA6 |
25870 |
||||
TI/德州仪器 |
23+ |
DSBGA6 |
50000 |
进口原装假一罚十特价销售欢迎咨询 |
|||
TI |
23+ |
DSBGA-6 |
8000 |
TI优势物料,欢迎询价 |
|||
TI/德州仪器 |
2218+ |
DSBGA-6 |
56600 |
A3-7货柜原装正品支持实单 |
|||
TI |
24+ |
DSBGA-6 |
30000 |
专业代理销售芯片 授权分销全系列产品 |
|||
TI |
21+ |
DSBGA6 |
12000 |
全新原装公司现货
|
|||
TI |
23+ |
DSBGA (YPH)-6 |
4000 |
只做原装 支持实单 假一罚十 |
|||
TI |
23+ |
DSBGA-6 |
30000 |
全新原装正品 |
|||
TI |
23+ |
DSBGA6 |
8500 |
正规渠道,只有原装! |
|||
TI(德州仪器) |
24+ |
DSBGA-6 |
19048 |
原厂可订货,技术支持,直接渠道。可签保供合同 |
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