1 Features

• SOT-23 (DYD) package with 60.3°C/W RθJA

available

• Input voltage range: 1.45V to 5.5V

• Available in fixed-output voltages:

– 0.6V to 5V (50mV steps)

• Low IQ: 25μA (typical)

• Low dropout:

– 425mV (maximum) at 1A (3.3VOUT)

• Output accuracy: 1% (maximum)

• Built-in soft-start with monotonic VOUT rise

• Foldback current limit

• Active output discharge

• High PSRR: 45dB at 100kHz

• Stable with a 1μF ceramic output capacitor

• Packages:

– 2.9mm × 2.8mm SOT-23-5 (DBV)

– 2.9mm × 2.8mm SOT-23-5 (DYD) with thermal

pad

– 2mm × 2mm WSON-6 (DRV)

2 Applications

• Set-top boxes, TV, and gaming consoles

• Portable and battery-powered equipment

• Desktops, notebooks, and ultrabooks

• Tablets and remote controls

• White goods and appliances

• Grid infrastructure and protection relays

• Camera modules and image sensors

3 Description

The TLV757P low-dropout regulator (LDO) is an

ultra-small, low quiescent current LDO that sources

1A with good line and load transient performance.

The TLV757P is optimized for a wide variety of

applications by supporting an input voltage range from

1.45V to 5.5V. To minimize cost and solution size,

the device is offered in fixed output voltages ranging

from 0.6V to 5V. This range supports the lower

core voltages of modern microcontrollers (MCUs).

Additionally, the TLV757P has a low IQ with enable

functionality to minimize standby power. This device

features an internal soft-start to lower the inrush

current. This feature provides a controlled voltage to

the load and minimizes the input voltage drop during

start-up. When shutdown, the device actively pulls

down the output to quickly discharge the outputs and

provides a known start-up state.

The TLV757P is stable with small ceramic output

capacitors allowing for a small overall solution size.

A precision band-gap and error amplifier provides

a typical accuracy of 1%. All device versions

have integrated thermal shutdown, current limit, and

undervoltage lockout (UVLO). The TLV757P has

an internal foldback current limit that helps reduce

thermal dissipation during short-circuit events.

The TLV757 is available in the popular SON and

SOT23-5 packages. This device is also available in

a thermally enhanced SOT23-5 package (DYD) with

a thermal pad. This package provides significantly

reduced thermal resistance compared to a standard

SOT23-5 package.