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TLV75510PDQNR.A中文资料
TLV75510PDQNR.A数据手册规格书PDF详情
1 Features
• SOT-23-5 package with 60.3°C/W RθJA available
• Input voltage range: 1.45V to 5.5V
• Low IQ: 25μA (typical)
• Low dropout:
– 238mV (maximum) at 500mA (3.3VOUT)
• Output accuracy: 1% (maximum at 85°C)
• Built-in soft-start with monotonic VOUT rise
• Foldback current limit
• Active output discharge
• High PSRR: 46dB at 100kHz
• Stable with a 1μF ceramic output capacitor
• Packages:
– 2.9mm × 2.8mm SOT-23-5 (DBV)
– 2.9mm × 2.8mm SOT-23-5 (DYD) with thermal
pad
– 1mm × 1mm X2SON-4 (DQN)
– 2mm × 2mm WSON-6 (DRV)
2 Applications
• Set-top boxes, TV, and gaming consoles
• Portable and battery-powered equipment
• Desktops, notebooks, and ultrabooks
• Tablets and remote controls
• White goods and appliances
• Grid infrastructure and protection relays
• Camera modules and image sensors
3 Description
The TLV755P is an ultra-small, low quiescent current,
low-dropout regulator (LDO) that sources 500mA
with good line and load transient performance.
The TLV755P is optimized for a wide variety of
applications by supporting an input voltage range
from 1.45V to 5.5V. To minimize cost and solution
size, the device is offered in fixed output voltages
ranging from 0.6V to 5V to support the lower
core voltages of modern microcontrollers (MCUs).
Additionally, the TLV755P has a low IQ with enable
functionality to minimize standby power. This device
features an internal soft-start to lower inrush current,
thus providing a controlled voltage to the load and
minimizing the input voltage drop during start up.
When shutdown, the device actively pulls down the
output to quickly discharge the outputs and provide a
known start-up state.
The TLV755P is stable with small ceramic output
capacitors allowing for a small overall solution size.
A precision band-gap and error amplifier provides
a typical accuracy of 1%. All device versions
have integrated thermal shutdown, current limit, and
undervoltage lockout (UVLO). The TLV755P has an
internal foldback current limit that helps reduce the
thermal dissipation during short-circuit events.
The TLV755 is available in the popular WSON,
X2SON, and SOT23-5 (DRV, DQN, and DBV)
packages. This device is also available in a
thermally enhanced SOT23-5 (DYD) package with
a thermal pad that provides significantly reduced
thermal resistance compared to a standard SOT23-5
package.
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TI/德州仪器 |
25+ |
原厂封装 |
10280 |
原厂授权代理,专注军工、汽车、医疗、工业、新能源! |
|||
TI/德州仪器 |
25+ |
原厂封装 |
10280 |
||||
TI/德州仪器 |
25+ |
原厂封装 |
11000 |
||||
TI/德州仪器 |
25+ |
原厂封装 |
10280 |
||||
TI(德州仪器) |
2021+ |
X2SON-4 |
499 |
||||
TI |
25+ |
X2SON (DQN) |
6000 |
原厂原装,价格优势 |
|||
TI |
22+ |
4-XDFN |
9000 |
原厂渠道,现货配单 |
|||
TI(德州仪器) |
24+ |
X2SON4 |
7350 |
现货供应,当天可交货!免费送样,原厂技术支持!!! |
|||
Texas Instruments |
25+ |
4-XDFN 裸露焊盘 |
9350 |
独立分销商 公司只做原装 诚心经营 免费试样正品保证 |
|||
TI |
24+ |
con |
10000 |
查现货到京北通宇商城 |
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