位置:TIBPAL16R4-30MFKB > TIBPAL16R4-30MFKB详情

TIBPAL16R4-30MFKB中文资料

厂家型号

TIBPAL16R4-30MFKB

文件大小

1007Kbytes

页面数量

26

功能描述

LOW-POWER HIGH-PERFORMANCE IMPACT™ PAL® CIRCUITS

LOW-POWER HIGH-PERFORMANCE IMPACT

数据手册

下载地址一下载地址二到原厂下载

生产厂商

TI2

TIBPAL16R4-30MFKB数据手册规格书PDF详情

High-Performance Operation:

Propagation Delay

C Suffix . . . 25 ns Max

M Suffix . . . 30 ns Max

Functionally Equivalent, but Faster Than

PAL16L8A, PAL16R4A, PAL16R6A, and

PAL16R8A

Power-Up Clear on Registered Devices (All

Register Outputs Are Set High, but Voltage

Levels at the Output Pins Go Low)

Package Options Include Both Plastic and

Ceramic Chip Carriers in Addition to Plastic

and Ceramic DIPs

Dependable Texas Instruments Quality and

Reliability

description

These programmable array logic devices feature

high speed and functional equivalency when

compared with currently available devices. These

IMPACT™ circuits combine the latest Advanced

Low-Power Schottky technology with proven

titanium-tungsten fuses to provide reliable,

high-performance substitutes for conventional

TTL logic. Their easy programmability allows for

quick design of custom functions and typically

results in a more compact circuit board. In

addition, chip carriers are available for further

reduction in board space.

The TIBPAL16’ C series is characterized from 0°C

to 75°C. The TIBPAL16’ M series is characterized

for operation over the full military temperature

range of −55°C to 125°C.

TIBPAL16R4-30MFKB产品属性

  • 类型

    描述

  • 型号

    TIBPAL16R4-30MFKB

  • 制造商

    TI

  • 制造商全称

    Texas Instruments

  • 功能描述

    LOW-POWER HIGH-PERFORMANCE IMPACT

更新时间:2025-10-8 10:31:00
供应商 型号 品牌 批号 封装 库存 备注 价格
TI
2021+
60000
原装现货,欢迎询价
TI
18+
N/A
6000
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TI
2308+
LCC
4862
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TI
20+
N/A
3600
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TI/德州仪器
25+
CDIP-20
9980
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TI
01+
28
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23+
DIP-20
11200
原厂授权一级代理、全球订货优势渠道、可提供一站式BO
TI/德州仪器
22+
CDIP
12245
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TI/德州仪器
24+
CDIP
1500
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LINEAR/凌特
QQ咨询
CDIP
271
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