1FEATURES

2• Very Low Total Quiescent Current:

3.5 mA at 3 V

• Disabled Supply Current: 0.15 μA

• Third-Order Butterworth Low-Pass Filters:

– –1 dB at 17 MHz

– –3 dB at 20 MHz

– Attenuation: 21 dB at 43 MHz

– Supports Y’P’BP’R 480p/576p or

R’G’B’ Video third–

Supports Oversampled Systems

Generating CVBS, S-Video, or

Y’P’BP’R 480i/576i

• DC-Coupled Input with 150-mV Output Shift

• Built-In Gain: 4 V/V (12 dB)

• Single-Supply Operation: +2.6 V to +5 V

• Rail-to-Rail Output Supports

AC- or DC-Coupling

• Low Differential Gain/Phase: 0.1%/0.1°

• Output Pins Support ±8-kV IEC ESD Protection

• Ultra Small, WCSP 9-Ball Package:

– Tiny PCB Area: 0.96 mm x 0.96 mm (Typ)

– Very Low Profile Height: 0.5 mm (Max)

– Pitch: 0.3 mm

APPLICATIONS

• Personal Media Players

• Digital Cameras

• Cellular Phone Video Output Buffering

DESCRIPTION

Fabricated using the revolutionary, complementary

Silicon-Germanium (SiGe) BiCom-3X process, the

THS7320 is a very low power, single-supply, 2.6-V to

5-V, three-channel integrated video buffer with a gain

of 4 V/V. This device is ideal for battery-powered

applications where size and power are critical

parameters. The total quiescent current is only 3.5

mA at 3 V and the video portion can be reduced

down to 0.15 μA while disabled.

The THS7320 video section incorporates three

enhanced definition (ED) filter channels with third–

order Butterworth characteristics. These filters are

useful as digital-to-analog converter (DAC)

reconstruction filters or as analog-to-digital converter

(ADC) antialiasing filters. The THS7320 is also ideal

for oversampled systems that produce standard

definition (SD) signals including CVBS, S-Video,

480i/576iY’P’BP’R, Y’U’V’, and R’G’B’.

The THS7320 is designed for dc-coupled inputs. To

mitigate any DAC/encoder termination interaction, the

input impedance is a very high 2.4 MΩ. The internal

level shift adds 150-mV offset at the output to

eliminate saturation or clipping concerns. The rail-to-

rail output supports either dc- or ac- coupling.

The THS7320 is available in an ultra small, 9-ball

wafer chip-scale package (WCSP) package that

requires an ultra small, 0.92-mm2 (typ) printed circuit

board (PCB) area.