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TDA54X中文资料
TDA54X数据手册规格书PDF详情
1 Features
Processor cores:
• Up-to Eight Arm® Cortex®-A720AE MPUs
– Lockstep capable
Real-Time processing CPUs :
• Up-to 6x Arm® Cortex®-R52+ (or 3x pairs in
Lockstep)
– Virtualization for multi-core processing
System/SOC CPUs:
• 8x Dual Arm® Cortex®-M55 (Lockstep)
DSP / AI processing :
• Up to 4x C7™ neural processing unit(NPU)
– Up to 400 TOPS
Vision and video processing:
• Up to 16 cameras
• DMPAC: Dense Optical Flow, Stereo Disparity
Engine
• 4x CSI-2 RX interface, 1x CSI-2 TX output
GPU and display processing:
• Imagination DXS Family GPU
Display subsystem:
• eDP1.5/DP2.1
– Multi-Stream Transport (up to 4 displays, up to
4K60fps)
• 1x DSI CPHY-2.0/DPHY-2.1
– Up to 4 lanes per port (muxed with CSI-TX)
• DSS Controller:
– 4 pipelines + 1 Writeback path, up to 4k60 per
pipe
Networking subsystem:
• NPAC (Network Processing Accelerator)
specialized subsystem for Ethernet switching and
packet transfer
• Integrated Ethernet Switch
– 8 external ports
– 10base-T1S (OA3P 3-wire i/f) supported on all
ports
– MACSEC per port, supports line rate
Memory:
• LPDDR4x/5/5x interface
– In-line ECC
• 1x UFS3.0
• 1x eMMC5.1 HS200
• 2x XSPI interface up to 400MBps
Security:
• SHE/EVITA Full compliant HSM, ISO21434
compliant
Functional Safety:
• Functional Safety-Compliant targeted for
ISO26262 and IEC61530
• AEC - Q100 qualified
Safety features:
• Support for full ASIL D or mixed ASIL D / ASIL B
with FFI
High-speed serial interfaces:
• 2x PCIe up to 4L
– Gen5 controller
– Root complex or Endpoint
• 1x USB3.2 (Gen 2)/eUSB2.0
Video acceleration:
• H.264/H.265 Encode/Decode: 1.0GP/s encode or
decode, up to 10b support
Serial interfaces:
• Up to 170 General-Purpose Input/Output (GPIO)
pin capability
TPS6594-Q1 Companion Power Management ICs
(PMIC):
• Functional Safety-Compliant support up to ASIL
D/SIL 3
• Flexible mapping to support different use cases
2 Applications
• Automotive:
• Autonomous sensor fusion / perception systems including camera, radar and LiDAR sensors
• ADAS Domain Controller
• Advanced surround view and park assistance systems
• Off-highway vehicle control
• Industrial:
• Industrial mobile robot (AGV/AMR) with safety functions
• Construction and agriculture
• Aerospace and defense
3 Description
The TDA5 high-performance compute SoC family is designed to deliver safe and efficient edge AI performance,
with capabilities of up to 1200 TOPS, with integrated C7™ NPU and chiplet-ready architecture. This enables
seamless progression to L3 autonomous driving in software-defined vehicles, where conditional automation
is possible in both urban and highway environments. Additionally, the TDA5 SoCs are well-suited for similar
applications in industrial transportation, humanoid and industrial robots, and aerospace and defense with their
advanced sensor processing, cybersecurity, and functional safety features.
The TDA5 SoCs feature multiple specialized subsystems, each tailored to address the growing demand for
high-performance compute and cross-domain applications. These subsystems include dedicated processing
cores and hardware acceleration for security, vision processing, edge AI, display rendering, and networking.
By offloading these tasks, the SoCs' MPU and MCU cores are freed up to focus on user application software.
Furthermore, support for PCIe, Ethernet, and other automotive standard peripherals enables safe, secure, and
high-speed data transfer between different components and systems.
Building on two decades of leadership in the automotive processor market, the TDA5 architecture is designed to
provide a scalable and high-performance solution for a wide range of applications. As an evolution of the TDA4
family, software developed for TDA4 can be easily scaled to the TDA5 family, with minimal rework required.
This allows for the reuse of software assets and enables the development of more complex and sophisticated
applications. The TDA5 family's unique combination of high-performance real-time and analytics cores, along
with the latest C7™ NPU and next-generation accelerators for image signal processing, makes it an optimized
solution for various camera, radar, sensor fusion, and AI applications.
The TDA5 family provides high-performance compute capabilities for both traditional computer vision and deep
learning algorithms, with industry-leading power/performance ratios. The high level of system integration enables
lower costs for advanced automotive platforms, supporting multiple sensor modalities in centralized ECUs,
multiple sensor domains, or a centralized automotive computer. Key processing and acceleration cores include
the latest-generation C7™ DSP with scalar and vector cores, dedicated deep learning acceleration, latest
application and GPU cores for general compute, a vision and imaging subsystem, video codec, network packet
processing accelerator, and Ethernet switch, as well as a dedicated security subsystem. These cores are
carefully integrated into an SoC architecture designed from the ground up to support functional safety at a
system level, ensuring the highest level of reliability and performance in safety-critical applications.
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
SIE |
24+ |
原厂封装 |
4000 |
原装现货假一罚十 |
|||
SIE |
24+ |
65230 |
|||||
PHI |
2022+ |
DIP |
70 |
原厂代理 终端免费提供样品 |
|||
PHI |
20+ |
DIP |
32500 |
现货很近!原厂很远!只做原装 |
|||
恩XP |
24+ |
DIP |
37500 |
全新原装现货,量大价优! |
|||
PHI |
24+ |
DIP |
12000 |
原装正品 有挂就有货 |
|||
SIEMENS |
26+ |
DIP |
12735 |
代理全系列销售,全新原装正品,价格优势,长期供应,量大可订 |
|||
24+ |
2500 |
自己现货 |
|||||
INFINEON/英飞凌 |
23+ |
SMD |
30000 |
百分百进口原装环保整盘 |
|||
SIEMENS/西门子 |
25+ |
DIP16 |
83 |
全新原装正品支持含税 |
TDA54X 资料下载更多...
TDA54X 芯片相关型号
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- 401-52880
- HG02-064-05
- L131S331LF
- PCL1D101MCL1GS
- PCL1D181MCL1GS
- PCL1D270MCL1GS
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- PML-D2V100W1AAB
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- SN8F570812
- SN8F570812SG
- SN8F570822
- SN8F570822TG
- SN8F57082SG
- SN8F57082TG
- SN8F57084
- SN8F57084JG
- SN8F57084KG
- SN8F57084SG
- SN8F57084TG
- SN8F57085
- SN8F57085TG
- SN8F57086
- TDA54-Q1
- TLV70736DQNR
- TLV70736DQNR.B
- TLV70736DQNT
- TLV70736DQNT.B
TI2相关芯片制造商
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