1.1 Features 1

• Architecture designed for ADAS applications

• Video, image, and graphics processing support

– Full-HD video (1920 × 1080p, 60 fps)

– Multiple video input and video output

• Dual Arm® Cortex®-A15 microprocessor subsystem

• Up to two C66x floating-point VLIW DSP

– Fully object-code compatible with C67x and C64x+

– Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle

• Up to 2.5MB of on-chip L3 RAM

• Level 3 (L3) and Level 4 (L4) interconnects

• Two DDR2/DDR3/DDR3L Memory Interface (EMIF) Modules

– Supports up to DDR2-800 and DDR3-1333

– Up to 2GB supported per EMIF

• Dual Arm® Cortex®-M4 Image Processing Units (IPU)

• Vision AccelerationPac

– Up to Two Embedded Vision Engines (EVEs)

• Imaging Subsystem (ISS)

– Image Signal Processor (ISP)

– Wide Dynamic Range and Lens Distortion Correction (WDR and Mesh LDC)

– One Camera Adaptation Layer (CAL_B)

• IVA-HD subsystem

• Display subsystem

– Display controller with DMA engine and up to three pipelines

– HDMI™ Encoder: HDMI 1.4a and DVI 1.0 Compliant

• 2D-graphics accelerator (BB2D) subsystem

– Vivante® GC320 core

• Video Processing Engine (VPE)

• Dual-core PowerVR® SGX544 3D GPU

• Two Video Input Port (VIP) modules

– Support for up to eight multiplexed input ports

• General-Purpose Memory Controller (GPMC)

• Enhanced Direct Memory Access (EDMA) controller

• 2-Port Gigabit Ethernet (GMAC)

• Up to Two Controller Area Network (DCAN) modules

– CAN 2.0B protocol

• Modular Controller Area Network (MCAN) module

– CAN 2.0B protocol with available FD (Flexible Data Rate) functionality

• MIPI CSI-2 camera serial interface

• PCI Express® 3.0 port with integrated PHY

– One 2-lane Gen2-compliant port

– or two 1-lane Gen2-compliant ports

• Sixteen 32-bit general-purpose timers

• 32-Bit MPU watchdog timer

• Ten configurable UART/IrDA/CIR modules

• Four Multichannel Serial Peripheral Interfaces (McSPI)

• Quad SPI interface

• Five Inter-Integrated Circuit (I2C) ports

• SATA interface

• Eight Multichannel Audio Serial Port (McASP) modules

• SuperSpeed USB 3.0 dual-role device

• Three high-speed USB 2.0 dual-role devices

• Four MultiMedia Card/Secure Digital/Secure Digital Input Output Interfaces ( MMC™/ SD®/SDIO)

• Up to 247 General-Purpose I/O (GPIO) pins

• Device security features

– Hardware crypto accelerators and DMA

– Firewalls

– JTAG® lock

– Secure keys

– Secure ROM and boot

– Customer programmable keys and OTP data

• Power, reset, and clock management

• On-Chip debug With CTools technology

• Automotive AEC-Q100 qualified

• 28-nm CMOS technology

• 23 mm × 23 mm, 0.8-mm pitch, 784-Pin BGA (ACD)