State-of-the-Art Advanced BiCMOS

Technology (ABT) Design for 3.3-V

Operation and Low-Static Power

Dissipation

Members of the Texas Instruments

Widebus Family

Support Mixed-Mode Signal Operation (5-V

Input and Output Voltages With 3.3-V VCC)

Support Unregulated Battery Operation

Down to 2.7 V

Typical VOLP (Output Ground Bounce)

< 0.8 V at VCC = 3.3 V, TA = 25°C

ESD Protection Exceeds 2000 V Per

MIL-STD-883C, Method 3015; Exceeds

200 V Using Machine Model

(C = 200 pF, R = 0)

Latch-Up Performance Exceeds 500 mA

Per JEDEC Standard JESD-17

Bus-Hold Data Inputs Eliminate the Need

for External Pullup Resistors

Support Live Insertion

Distributed VCC and GND Pin Configuration

Minimizes High-Speed Switching Noise

Flow-Through Architecture Optimizes

PCB Layout

Package Options Include Plastic 300-mil

Shrink Small-Outline (DL) and Thin Shrink

Small-Outline (DGG) Packages and 380-mil

Fine-Pitch Ceramic Flat (WD) Package

Using 25-mil Center-to-Center Spacings

description

The ’LVT16543 are 16-bit registered transceivers designed for low-voltage (3.3-V) VCC operation, but with the

capability to provide a TTL interface to a 5-V system environment. These devices can be used as two 8-bit

transceivers or one 16-bit transceiver. Separate latch-enable (LEAB or LEBA) and output-enable (OEAB or

OEBA) inputs are provided for each register to permit independent control in either direction of data flow.

The A-to-B enable (CEAB) input must be low in order to enter data from A or to output data from B. If CEAB

is low and LEAB is low, the A-to-B latches are transparent; a subsequent low-to-high transition of LEAB puts

the A latches in the storage mode. With CEAB and OEAB both low, the 3-state B outputs are active and reflect

the data present at the output of the A latches. Data flow from B to A is similar but requires using the CEBA,

LEBA, and OEBA inputs.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup

resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74LVT16543 is available in TI’s shrink small-outline (DL) and thin shrink small-outline (DGG) packages,

which provide twice the I/O pin count and functionality of standard small-outline packages in the same

printed-circuit-board area.

The SN54LVT16543 is characterized for operation over the full military temperature range of −55°C to 125°C.

The SN74LVT16543 is characterized for operation from −40°C to 85°C.