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SN74LVC1G99DCTT.B中文资料

厂家型号

SN74LVC1G99DCTT.B

文件大小

716.78Kbytes

页面数量

27

功能描述

Ultra-Configurable Multiple-Function Gate With 3-State Output

数据手册

下载地址一下载地址二到原厂下载

生产厂商

TI2

SN74LVC1G99DCTT.B数据手册规格书PDF详情

1FEATURES

2• Available in Texas Instruments

NanoFree™ Package

• Supports 5-V VCC Operation

• Inputs Accept Voltages to 5.5 V

• Supports Down Translation to VCC

• Max tpd of 6.7 ns at 3.3 V

• Low Power Consumption, 10-μA Max I CC

• ±24-mA Output Drive at 3.3 V

• Offers Nine Different Logic Functions in a

Single Package

• Ioff Supports Live Insertion, Partial-Power-

Down Mode, and Back-Drive Protection

• Input Hysteresis Allows for Slow Input

Transition Time and Better Noise Immunity at

Input

• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

• ESD Protection Exceeds JESD 22

– 2000-V Human-Body Model (A114-A)

– 200-V Machine Model (A115-A)

– 1000-V Charged-Device Model (C101)

DESCRIPTION

The SN74LVC1G99 device is operational from 1.65 V

to 5.5 V.

The SN74LVC1G99 device features configurable

multiple functions with a 3-state output. The output is disabled when the output-enable (OE) input is high.

When OE is low, the output state is determined by 16

patterns of 4-bit input. The user can choose logic

functions, such as MUX, AND, OR, NAND, NOR,

XOR, XNOR, inverter, and buffer. All inputs can be

connected to VCC or GND.

This device functions as an independent inverter, but

because of Schmitt action, it has different input

threshold levels for positive-going (VT+) and negative-

going (VT–) signals.

To ensure the high-impedance state during power up

or power down, OE should be tied to VCC through a

pullup resistor; the minimum value of the resistor is

determined by the current-sinking capability of the

driver.

This device is fully specified for partial-power-down

applications using Ioff. The Ioff circuitry disables the

outputs, preventing damaging current backflow

through the device when it is powered down.

NanoFree™ package technologies are a major

breakthrough in IC packaging concepts, using the die

as the package.

更新时间:2025-10-4 15:14:00
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