位置:SN74CBTLV3383DW.B > SN74CBTLV3383DW.B详情

SN74CBTLV3383DW.B中文资料

厂家型号

SN74CBTLV3383DW.B

丝印代码

CBTLV3383

封装外壳

SOIC

文件大小

762.58Kbytes

页面数量

26

功能描述

SN74CBTLV3383 Low-Voltage 10-Bit FET Bus-Exchange Switch

数据手册

下载地址一下载地址二到原厂下载

生产厂商

TI2

SN74CBTLV3383DW.B数据手册规格书PDF详情

1 Features

1• 5-Ω Switch Connection Between Two Ports

• Rail-to-Rail Switching on Data I/O Ports

• Ioff Supports Partial-Power-Down Mode Operation

• Latch-Up Performance Exceeds 250 mA Per

JESD 17

• ESD Protection Exceeds JESD 22

– 2000-V Human-Body Model (A114-A

– 200-V Machine Model (A115-A)

2 Applications

• Gaming

• Rack Server

• Communication Board

3 Description

The SN74CBTLV3383 provides ten bits of high-speed

bus switching or exchanging. The low on-state

resistance of the switch allows connections to be

made with minimal propagation delay.

The device operates as a 10-bit bus switch or as a 5-

bit bus exchanger, which provides swapping of the A

and B pairs of signals. The bus-exchange function is

selected when BX is high, and BE is low.

This device is fully specified for partial-power-down

applications using Ioff. The Ioff feature ensures that

damaging current will not backflow through the device

when it is powered down. The device has isolation

during power off.

更新时间:2026-7-31 15:30:00
供应商 型号 品牌 批号 封装 库存 备注 价格
西门子
24+
TO92
6600
TI/德州仪器
2402+
QFN
8324
原装正品!实单价优!
TI
23+
BGA
50000
全新原装正品现货,支持订货
TI/德州仪器
23+
BGA
3000
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、
TI
15+
BGA
2860
一级代理,专注军工、汽车、医疗、工业、新能源、电力
TI
23+
BGA
3200
正规渠道,只有原装!
TI/德州仪器
24+
BGA
2860
只供应原装正品 欢迎询价
TI
23+
BGA
12800
公司只有原装 欢迎来电咨询。
TI
23+
BGA
5000
全新原装,支持实单,非诚勿扰
TI
23+
BGA
3200
公司只做原装,可来电咨询