1FEATURES

2• Available in the Texas Instruments NanoStar™

Package

• Low Static-Power Consumption

(ICC = 0.9 μA Maximum)

• Low Dynamic-Power Consumption

(Cpd = 4.3 pF Typ at 3.3 V)

• Low Input Capacitance (Ci = 1.5 pF Typical)

• Low Noise – Overshoot and Undershoot

<10% of VCC

• Ioff Supports Partial-Power-Down Mode

Operation

• Wide Operating VCC Range of 0.8 V to 3.6 V

• Optimized for 3.3-V Operation

• 3.6-V I/O Tolerant to Support Mixed-Mode

Signal Operation

• tpd = 4.3 ns Maximum at 3.3 V

• Suitable for Point-to-Point Applications

• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

• ESD Performance Tested Per JESD 22

– 2000-V Human-Body Model

(A114-B, Class II)

– 1000-V Charged-Device Model (C101)

DESCRIPTION/ORDERING INFORMATION

The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable

applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range

of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal

integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the

package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,

preventing damaging current backflow through the device when it is powered down.