位置:SN74AUP2G126DCUR.B > SN74AUP2G126DCUR.B详情

SN74AUP2G126DCUR.B中文资料

厂家型号

SN74AUP2G126DCUR.B

文件大小

973.99Kbytes

页面数量

30

功能描述

LOW-POWER DUAL BUS BUFFER GATE WITH 3-STATE OUTPUTS

数据手册

下载地址一下载地址二到原厂下载

生产厂商

TI2

SN74AUP2G126DCUR.B数据手册规格书PDF详情

1FEATURES

• Available in the Texas Instruments NanoStar™

Package

• Low Static-Power Consumption

(ICC = 0.9 μA Max)

• Low Dynamic-Power Consumption

(Cpd = 4 pF Typ at 3.3 V)

• Low Input Capacitance (Ci = 1.5 pF Typ)

• Low Noise – Overshoot and Undershoot

<10% of VCC

• Input-Disable Feature Allows Floating Input

Conditions

• Ioff Supports Partial-Power-Down Mode

Operation

• Input Hysteresis Allows Slow Input Transition

and Better Switching Noise Immunity at Input

• Wide Operating VCC Range of 0.8 V to 3.6 V

• Optimized for 3.3-V Operation

• 3.6-V I/O Tolerant to Support Mixed-Mode

Signal Operation

• tpd = 9.9 ns Max at 3.3 V

• Suitable for Point-to-Point Applications

• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

• ESD Performance Tested Per JESD 22

– 2000-V Human-Body Model

(A114-B, Class II)

– 1000-V Charged-Device Model (C101)

DESCRIPTION/ORDERING INFORMATION

The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable

applications. This family ensures a very low static and dynamic power consumption across the entire VCC range

of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see

Figure 1 and Figure 2).

The SN74AUP2G126 is a dual bus driver/line driver with 3-state outputs, designed for 0.8-V to 3.6-V VCC

operation. The outputs are disabled when the associated output-enable (OE) input is low. This device has the

input-disable feature, which allows floating input signals.

To ensure the high-impedance state during power up or power down, OE should be tied to GND through a

pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the

package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,

preventing damaging current backflow through the device when it is powered down.

更新时间:2025-11-3 16:25:00
供应商 型号 品牌 批号 封装 库存 备注 价格
TexasInstruments
18+
ICBUFF/DVR3STDUALLP8X2SO
6800
公司原装现货/欢迎来电咨询!
TI
20+
原装
53650
TI原装主营-可开原型号增税票
Texas Instruments
24+
8-X2SON(1.4x1.0)
65200
一级代理/放心采购
TI
25+
DFN-8
9854
就找我吧!--邀您体验愉快问购元件!
TI
22+
8X2SON (1.4x1.0)
9000
原厂渠道,现货配单
TI/德州仪器
23+
X2SON-8
11200
原厂授权一级代理、全球订货优势渠道、可提供一站式BO
TI/德州仪器
24+
X2SON-8
604
只供应原装正品 欢迎询价
TI(德州仪器)
24+
X2SON8(1x1
5001
原装现货,免费供样,技术支持,原厂对接
Texas Instruments(德州仪器)
24+
VQFN-32
690000
代理渠道/支持实单/只做原装
TI
50