1FEATURES

2· Available in the Texas Instruments

NanoFree™ Package

· Low Static-Power Consumption

(ICC = 0.9 mA Max)

· Low Dynamic-Power Consumption

(Cpd = 5 pF Typ at 3.3 V)

· Low Input Capacitance (CI = 1.5 pF)

· Low Noise – Overshoot and Undershoot

<10% of VCC

· Input-Disable Feature Allows Floating Input

Conditions

· Ioff Supports Partial-Power-Down Mode

Operation

· Includes Schmitt-Trigger Inputs

· Wide Operating VCC Range of 0.8 V to 3.6 V

· Optimized for 3.3-V Operation

· 3.6-V I/O Tolerant to Support Mixed-Mode

Signal Operation

· tpd = 7.4 ns Max at 3.3 V

· Suitable for Point-to-Point Applications

· Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

· ESD Performance Tested Per JESD 22

– 2000-V Human-Body Model

(A114-B, Class II)

– 200-V Machine Model (A115-A)

– 1000-V Charged-Device Model (C101)

DESCRIPTION/ORDERING INFORMATION

The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable

applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range

of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see

Figures 1 and 2).

The SN74AUP1G99 features configurable multiple functions with a 3-state output. This device has the

input-disable feature, which allows floating input signals. The inputs and output are disabled when the

output-enable (OE) input is high. When OE is low, the output state is determined by 16 patterns of 4-bit input.

The user can choose the logic functions, such as MUX, AND, OR, NAND, NOR, XOR, XNOR, inverter, and

buffer. All inputs can be connected to VCC or GND.

This device functions as an independent gate with Schmitt-trigger inputs, which allows for slow input transition

and better switching noise immunity at the input.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup

resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the

die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,

preventing damaging current backflow through the device when it is powered down.