1 Features

1• Available in the Texas Instruments NanoStar™

Package

• Low Static-Power Consumption:

ICC = 0.9 μA Maximum

• Low Dynamic-Power Consumption:

Cpd = 3 pF Typical at 3.3 V

• Low Input Capacitance:

Ci = 1.5 pF Typical

• Low Noise: Overshoot and Undershoot

< 10% of VCC

• Ioff Supports Partial Power-Down-Mode Operation

• Input Hysteresis Allows Slow Input Transition and

Better Switching Noise Immunity at the Input

(Vhys = 250 mV Typical at 3.3 V)

• Wide Operating VCC Range of 0.8 V to 3.6 V

• Optimized for 3.3-V Operation

• 3.6-V I/O Tolerant to Support Mixed-Mode Signal

Operation

• tpd = 4 ns Maximum at 3.3 V

• Suitable for Point-to-Point Applications

• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

• ESD Performance Tested Per JESD 22

– 2000-V Human-Body Model

(A114-B, Class II)

– 1000-V Charged-Device Model (C101)

2 Applications

• Barcode Scanner

• Cable Solutions

• E-Book

• Embedded PC

• Field Transmitter: Temperature or Pressure

Sensor

• Fingerprint Biometrics

• HVAC: Heating, Ventilating, and Air Conditioning

• Network-Attached Storage (NAS)

• Server Motherboard and PSU

• Software Defined Radio (SDR)

• TV: High-Definition (HDTV), LCD, and Digital

• Video Communications System

• Wireless Data Access Card, Headset, Keyboard,

Mouse, and LAN Card

3 Description

The AUP family is TI's premier solution to the

industry's low-power needs in battery-powered

portable applications. This family assures a very-low

static and dynamic power consumption across the

entire VCC range of 0.8 V to 3.6 V, thus resulting in an

increased battery life. The AUP devices also maintain

excellent signal integrity.

The SN74AUP1G79 is a single positive-edgetriggered

D-type flip-flop. When data at the data (D)

input meets the setup-time requirement, the data is

transferred to the Q output on the positive-going edge

of the clock pulse. Clock triggering occurs at a

voltage level and is not directly related to the rise

time of the clock pulse. Following the hold-time

interval, data at the D input can be changed without

affecting the levels at the outputs.

NanoStar™ package technology is a major

breakthrough in IC packaging concepts, using the die

as the package.

The SN74AUP1G79 device is fully specified for

partial-power-down applications using Ioff. The Ioff

circuitry disables the outputs when the device is

powered down. This inhibits current backflow into the

device which prevents damage to the device.