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SN74AUP1G240DRYR.B中文资料

厂家型号

SN74AUP1G240DRYR.B

文件大小

2314.01Kbytes

页面数量

47

功能描述

SN74AUP1G240 Low-Power Single Inverter With 3-State Output

数据手册

下载地址一下载地址二到原厂下载

生产厂商

TI2

SN74AUP1G240DRYR.B数据手册规格书PDF详情

1 Features

1• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

• ESD Performance Tested Per JESD 22

– 2000-V Human-Body Model

(A114-B, Class II)

– 1000-V Charged-Device Model (C101)

• Available in the Texas Instruments NanoStar™

Package

• Low Static-Power Consumption

– ICC = 0.9 μA Maximum

• Low Dynamic-Power Consumption

– Cpd = 4.2 pF at 3.3 V Typical

• Low Input Capacitance

– CI = 1.5 pF Typical

• Low Noise – Overshoot and Undershoot

<10% of VCC

• Input-Disable Feature Allows Floating Input

Conditions

• Ioff Supports Partial Power-Down-Mode Operation

• Input Hysteresis Allows Slow Input Transition and

Better Switching Noise Immunity at the Input

• Wide Operating VCC Range of 0.8 V to 3.6 V

• Optimized for 3.3-V Operation

• 3.6-V I/O Tolerant to Support Mixed-Mode Signal

Operation

• tpd = 4.7 ns Maximum at 3.3 V

• Suitable for Point-to-Point Applications

2 Applications

• Grid infrastructure

• Telecom Infrastructure

• Medical, Healthcare, and Fitness

• Factory Automation and Control

• Printers and Other Peripherals

3 Description

The AUP family is TI's premier solution to the

industry's low power needs in battery-powered

portable applications. This family assures a very low

static and dynamic power consumption across the

entire VCC range of 0.8 V to 3.6 V, resulting in an

increased battery life. This product also maintains

excellent signal integrity (see AUP – The Lowest-

Power Family ).

This buffer/driver is a single line driver with a 3-state

output. The output is disabled when the outputenable

(OE) input is high. This device has the inputdisable

feature, which allows floating input signals.

To assure the high-impedance state during power up

or power down, OE should be tied to VCC through a

pullup resistor; the minimum value of the resistor is

determined by the current-sinking capability of the

driver.

NanoStar™ package technology is a major

breakthrough in IC packaging concepts, using the die

as the package.

This device is fully specified for partial-power-down

applications using Ioff. The Ioff circuitry disables the

outputs when the device is powered down. This

inhibits current backflow into the device which

prevents damage to the device.

更新时间:2025-12-10 16:49:00
供应商 型号 品牌 批号 封装 库存 备注 价格
TI原装一盘5K
25+23+
XFDFN-6
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Texas Instruments
24+
6-SON(1x1)
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TI
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DFN-6
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2021+
SON-6
499
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23+
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3000
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TI
22+
6SON
9000
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TI一盘5K
22+
XFDFN-6
30000
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TI(德州仪器)
24+
SON6
7350
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TI
2526+
原厂封装
12500
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