1 Features

1• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

• ESD Performance Tested Per JESD 22−

– 2000-V Human-Body Model

(A114-B, Class II)

– 1000-V Charged-Device Model (C101)

• Available in the Texas Instruments NanoStar™

Package

• Low Static-Power Consumption

(ICC = 0.9 μA Maximum)

• Low Dynamic-Power Consumption

(Cpd = 4 pF Typical at 3.3 V)

• Low Input Capacitance (Ci = 1.5 pF Typical)

• Low Noise – Overshoot and Undershoot

<10% of VCC

• Input-Disable Feature Allows Floating Input

Conditions

• Ioff Supports Partial-Power-Down Mode Operation

• Input Hysteresis Allows Slow Input Transition and

Better Switching Noise Immunity at Input

• Wide Operating VCC Range of 0.8 V to 3.6 V

• Optimized for 3.3-V Operation

• 3.6-V I/O Tolerant to Support Mixed-Mode Signal

Operation

• tpd = 4.6 ns Maximum at 3.3 V

• Suitable for Point-to-Point Applications

2 Applications

• Audio Dock: Portable

• BluRay™ Players and Home Theaters

• Personal Digital Assistant (PDA)

• Power: Telecom/Server AC/DC Supply: Single

Controller: Analog and Digital

• Solid-State Drive (SSD): Client and Enterprise

• TV: LCD/Digital and High-Definition (HDTV)

• Tablet: Enterprise

• Wireless Headsets, Keyboards, and Mice

3 Description

The AUP family is TI's premier solution to the

industry's low-power needs in battery-powered

portable applications. This family assures a very low

static and dynamic power consumption across the

entire VCC range of 0.8 V to 3.6 V, resulting in an

increased battery life. This product also maintains

excellent signal integrity (see AUP – The Lowest-

Power Family and Excellent Signal Integrity ).

This bus buffer gate is a single line driver with a 3-

state output. The output is disabled when the outputenable

(OE) input is low. This device has the inputdisable

feature, which allows floating input signals.

To assure the high-impedance state during power up

or power down, OE should be tied to GND through a

pulldown resistor; the minimum value of the resistor is

determined by the current-sourcing capability of the

driver.

NanoStar™ package technology is a major

breakthrough in IC packaging concepts, using the die

as the package.

This device is fully specified for partial-power-down

applications using Ioff. The Ioff circuitry disables the

outputs when the device is powered down. This

inhibits current backflow into the device which

prevents damage to the device.