State-of-the-Art EPIC-IIBE BiCMOS Design

Significantly Reduces Power Dissipation

ESD Protection Exceeds 2000 V Per

MIL-STD-883, Method 3015; Exceeds 200 V

Using Machine Model (C = 200 pF, R = 0)

Latch-Up Performance Exceeds 500 mA Per

JESD 17

Typical VOLP (Output Ground Bounce) < 1 V

at VCC = 5 V, TA = 25°C

High-Drive Outputs (–32-mA IOH,

64-mA IOL)

Multiplexed Real-Time and Stored Data

Inverting Data Paths

Package Options Include Plastic

Small-Outline (DW), Shrink Small-Outline

DB), and Thin Shrink Small-Outline (PW)

Packages, Ceramic Chip Carriers (FK), and

Plastic (NT) and Ceramic (JT) DIPs

description

These devices consist of bus-transceiver circuits,

D-type flip-flops, and control circuitry arranged for

multiplexed transmission of data directly from the

data bus or from the internal storage registers.

Output-enable (OEAB and OEBA) inputs are

provided to control the transceiver functions. The

select-control (SAB and SBA) inputs are provided

to select whether real-time or stored data is

transferred. A low input level selects real-time

data, and a high input level selects stored data.

Figure 1 illustrates the four fundamental

bus-management functions that can be

performed with the ’ABT651 devices.

Data on the A or B bus, or both, can be stored in the internal D flip-flops by low-to-high transitions at the

appropriate clock (CLKAB or CLKBA) inputs, regardless of the select- or enable-control pins. When SAB and

SBA are in the real-time transfer mode, it also is possible to store data without using the internal D-type flip-flops

by simultaneously enabling OEAB and OEBA. In this configuration, each output reinforces its input. When all

the other data sources to the two sets of bus lines are at high impedance, each set remains at its last state.

To ensure the high-impedance state during power up or power down, OEBA should be tied to VCC through a

pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver

(B to A). OEAB should be tied to GND through a pulldown resistor; the minimum value of the resistor is

determined by the current-sourcing capability of the driver (A to B).