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SN74ABT16244ADGVR.B中文资料

厂家型号

SN74ABT16244ADGVR.B

文件大小

497.24Kbytes

页面数量

19

功能描述

16-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS

数据手册

下载地址一下载地址二到原厂下载

简称

TI2德州仪器

生产厂商

Texas Instruments

中文名称

美国德州仪器公司官网

LOGO

SN74ABT16244ADGVR.B数据手册规格书PDF详情

FEATURES

Members of the Texas Instruments

Widebus™ Family

State-of-the-Art EPIC-IIB™ BiCMOS Design

Significantly Reduces Power Dissipation

Latch-Up Performance Exceeds 500 mA Per

JESD 70

Typical VOLP (Output Ground Bounce) <1 V

at VCC = 5 V, TA = 25°C

Distributed VCC and GND Pin Configuration

Minimizes High-Speed Switching Noise

Flow-Through Architecture Optimizes PCB

Layout

High-Drive Outputs (–32-mA IOH, 64-mA IOL)

Package Options Include Plastic 300-mil

Shrink Small-Outline (DL), Thin Shrink

Small-Outline (DGG), and Thin Very

Small-Outline (DGV) Packages and 380-mil

Fine-Pitch Ceramic Flat (WD) Package

Using 25-mil Center-to-Center Spacings

DESCRIPTION

The SN54ABT16244 and SN74ABT16244A are 16-bit

buffers and line drivers designed specifically to

improve both the performance and density of 3-state

memory address drivers, clock drivers, and

bus-oriented receivers and transmitters. These

devices can be used as four 4-bit buffers, two 8-bit

buffers, or one 16-bit buffer. These devices provide

true outputs and symmetrical OE (active-low

output-enable) inputs.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup

resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN54ABT16244 is characterized for operation over the full military temperature range of –55°C to 125°C.

The SN74ABT16244A is characterized for operation from –40°C to 85°C.

更新时间:2025-7-24 16:45:00
供应商 型号 品牌 批号 封装 库存 备注 价格
TI
24+
SOP-8
3378
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2016+
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2016+
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8650
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993
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TI
25+23+
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Texas Instruments 美国德州仪器公司

中文资料: 22058条

德州仪器(Texas Instruments),简称TI,是全球领先的半导体公司,为现实世界的信号处理提供创新的数字信号处理(DSP)及模拟器件技术。除半导体业务外,还提供包括传感与控制、教育产品和数字光源处理解决方案。TI总部位于美国德克萨斯州的达拉斯,并在25多个国家设有制造、设计或销售机构。德州仪器是推动互联网时代不断发展的半导体引擎,作为实时技术的领导者,TI正在快速发展,在无线与宽带接入等大型市场及数码相机和数字音频等新兴市场方面,凭借性能卓越的半导体解决方案不断推动着互联网时代的前进步伐。TI预想未来世界的方方面面都渗透着TI产品的点点滴滴,每个电话、每次上网、拍的每张照片、听的每