1 Features

1• Small-size VSSOP Packages Save Board Space,

or SOIC for Drop-in Compatibility

• Bus I/O Protection

– >±15 kV HBM Protection

– >±12 kV IEC 61000-4-2 Contact Discharge

– >±4 kV IEC 61000-4-4 Fast Transient Burst

• Extended Industrial Temperature Range

–40°C to 125°C

• Large Receiver Hysteresis (80 mV) for Noise

Rejection

• Low Unit-Loading Allows Over 200 Connected

Nodes

• Low Power Consumption

– Low Standby Supply Current: < 2 μA

– ICC < 1 mA Quiescent During Operation

• 5-V Tolerant Logic Inputs Compatible With

3.3-V or 5-V Controllers

• Signaling Rate Options Optimized for:

250 kbps, 20 Mbps, 50 Mbps

• Glitch Free Power-Up and Power-Down Bus

Inputs and Outputs

2 Applications

• Factory Automation

• Telecommunications Infrastructure

• Motion Control

3 Description

These devices have robust 3.3-V drivers and

receivers in a small package for demanding industrial

applications. The bus pins are robust to ESD events

with high levels of protection to Human-Body Model

and IEC Contact Discharge specifications.

Each of these devices combines a differential driver

and a differential receiver which operate from a single

3.3-V power supply. The driver differential outputs

and the receiver differential inputs are connected

internally to form a bus port suitable for half-duplex

(two-wire bus) communication. These devices feature

a wide common-mode voltage range making the

devices suitable for multi-point applications over long

cable runs. These devices are characterized from

–40°C to 125°C.