1FEATURES

• High Speed (>1000 Mbps) Upgrade for

DS90CP22 2x2 LVDS Crosspoint Switch

• Low-Jitter Fully Differential Data Path

• 50 ps (Typ), of Peak-to-Peak Jitter With PRBS

= 223–1 Pattern

• Less Than 200 mW (Typ), 300 mW (Max) Total

Power Dissipation

• Output (Channel-to-Channel) Skew Is 80 ps

(Typ)

• Configurable as 2:1 Mux, 1:2 Demux, Repeater

or 1:2 Signal Splitter

• Inputs Accept LVDS, LVPECL, and CML

Signals

• Fast Switch Time of 1.7 ns (Typ)

• Fast Propagation Delay of 0.65 ns (Typ)

• Available in 16 pin CFP Package

• Inter-Operates With TIA/EIA-644-A LVDS

Standard

• Military Temperature Range: –55°C to 125°C

APPLICATIONS

• Base Stations

• Add/Drop Muxes

• Protection Switching for Serial Backplanes

• Network Switches/Routers

• Optical Networking Line Cards/Switches

• Clock Distribution

• Engineering Evaluation (/EM) Samples are

Available (1)

DESCRIPTION

The SN55LVCP22 is a 2×2 crosspoint switch

providing greater than 1000 Mbps operation for each path. The dual channels incorporate wide common-

mode (0 V to 4 V) receivers, allowing for the receipt

of LVDS, LVPECL, and CML signals. The dual

outputs are LVDS drivers to provide low-power, low-

EMI, high-speed operation. The SN55LVCP22 provides a single device supporting 2:2 buffering

(repeating), 1:2 splitting, 2:1 multiplexing, 2×2

switching, and LVPECL/CML to LVDS level

translation on each channel. The flexible operation of

the SN55LVCP22 provides a single device to support

the redundant serial bus transmission needs (working

and protection switching cards) of fault-tolerant switch systems found in optical networking, wireless

infrastructure, and data communications systems. TI

offers additional gigabit repeater/ translator and

crosspoint products in the SN65LVDS100 and SN65LVDS122.

The SN55LVCP22 uses a fully differential data path

to ensure low-noise generation, fast switching times,

low pulse width distortion, and low jitter. Output

channel-to- channel skew is 80 ps (typ) to ensure

accurate alignment of outputs in all applications. Both

SOIC and TSSOP package options are available to

allow easy upgrade for existing solutions, and board

area savings where space is critical.