State-of-the-Art Advanced BiCMOS

Technology (ABT) Design for 3.3-V

Operation and Low-Static Power

Dissipation

High-Impedance State During Power Up

and Power Down

Support Mixed-Mode Signal Operation (5-V

Input and Output Voltages With 3.3-V VCC)

Support Unregulated Battery Operation

Down to 2.7 V

Typical VOLP (Output Ground Bounce)

< 0.8 V at VCC = 3.3 V, TA = 25°C

Latch-Up Performance Exceeds 500 mA

Per JEDEC Standard JESD-17

Bus-Hold Data Inputs Eliminate the Need

for External Pullup Resistors

Package Options Include Plastic

Small-Outline (DW), Shrink Small-Outline

(DB), and Thin Shrink Small-Outline (PW)

Packages, Ceramic Chip Carriers (FK), and

Ceramic (J) DIPs

description

These octal buffers/drivers are designed

specifically for low-voltage (3.3-V) VCC operation

with the capability to provide a TTL interface to a

5-V system environment.

These devices are organized as two 4-bit line drivers with separate output-enable (OE) inputs. When OE is low,

the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the

high-impedance state.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

The SN74LVTZ244 is available in TI’s shrink small-outline package (DB), which provides the same I/O pin count

and functionality of standard small-outline packages in less than half the printed-circuit-board area.

The SN54LVTZ244 is characterized for operation over the full military temperature range of −55°C to 125°C.

The SN74LVTZ244 is characterized for operation from −40°C to 85°C.