FEATURES

· Members of the Texas Instruments Widebus™

Family

· State-of-the-Art Advanced BiCMOS

Technology (ABT) Design for 3.3-V Operation

and Low Static-Power Dissipation

· Support Mixed-Mode Signal Operation (5-V

Input and Output Voltages With 3.3-V VCC)

· Support Unregulated Battery Operation Down

to 2.7 V

· Typical VOLP (Output Ground Bounce) <0.8 V

at VCC = 3.3 V, TA = 25°C

· Ioff and Power-Up 3-State Support Hot

Insertion

· Bus Hold on Data Inputs Eliminates the Need

for External Pullup/Pulldown Resistors

· Distributed VCC and GND Pin Configuration

Minimizes High-Speed Switching Noise

· Flow-Through Architecture Optimizes PCB

Layout

· Latch-Up Performance Exceeds 500 mA Per

JESD 17

· ESD Protection Exceeds 2000 V Per

MIL-STD-883, Method 3015; Exceeds 200 V

Using Machine Model (C = 200 pF, R = 0)

· Package Options Include Plastic Shrink

Small-Outline (DL) and Thin Shrink

Small-Outline (DGG) Packages and 380-mil

Fine-Pitch Ceramic Flat (WD) Package Using

25-mil Center-to-Center Spacings