State-of-the-Art Advanced BiCMOS

Technology (ABT) Design for 3.3-V

Operation and Low-Static Power

Dissipation

Members of the Texas Instruments

WidebusE Family

Support Mixed-Mode Signal Operation (5-V

Input and Output Voltages With 3.3-V VCC)

Support Unregulated Battery Operation

Down to 2.7 V

Typical VOLP (Output Ground Bounce)

< 0.8 V at VCC = 3.3 V, TA = 25°C

ESD Protection Exceeds 2000 V Per

MIL-STD-883, Method 3015; Exceeds 200 V

Using Machine Model

C = 200 pF, R = 0)

Latch-Up Performance Exceeds 500 mA

Per JEDEC Standard JESD-17

Bus-Hold Data Inputs Eliminate the Need

for External Pullup Resistors

Support Live Insertion

Distributed VCC and GND Pin Configuration

Minimizes High-Speed Switching Noise

Flow-Through Architecture Optimizes

PCB Layout

Package Options Include Plastic 300-mil

Shrink Small-Outline (DL) and Thin Shrink

Small-Outline (DGG) Packages and 380-mil

Fine-Pitch Ceramic Flat (WD) Package

Using 25-mil Center-to-Center Spacings

description

The ’LVT16952 are 16-bit registered transceivers designed for low-voltage (3.3-V) VCC operation, but with the

capability to provide a TTL interface to a 5-V system environment. These devices can be used as two 8-bit

transceivers or one 16-bit transceiver. Data on the A or B bus is stored in the registers on the low-to-high

transition of the clock (CLKAB or CLKBA) input provided that the clock-enable (CLKENAB or CLKENBA) input

is low. Taking the output-enable (OEAB or OEBA) input low accesses the data on either port.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup

resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74LVT16952 is available in TI’s shrink small-outline (DL) and thin shrink small-outline (DGG) packages,

which provide twice the I/O pin count and functionality of standard small-outline packages in the same

printed-circuit-board area.