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PAL16R6AMJ.A中文资料

厂家型号

PAL16R6AMJ.A

文件大小

833.12Kbytes

页面数量

22

功能描述

STANDARD HIGH-SPEED PAL) CIRCUITS

数据手册

下载地址一下载地址二到原厂下载

生产厂商

TI2

PAL16R6AMJ.A数据手册规格书PDF详情

Choice of Operating Speeds

High-Speed, A Devices . . . 25 MHz Min

Half-Power, A-2 Devices . . . 16 MHz Min

Choice of Input/Output Configuration

Package Options Include Both Ceramic DIP

and Chip Carrier in Addition to Ceramic

Flat Package

description

These programmable array logic devices feature

high speed and a choice of either standard or

half-power devices. They combine Advanced

Low-Power Schottky technology with proven

titanium-tungsten fuses. These devices will

provide reliable, high-performance substitutes for

conventional TTL logic. Their easy

programmability allow for quick design of ”custom”

functions and typically results in a more compact

circuit board. In addition, chip carriers are

available for further reduction in board space.

The Half-Power versions offer a choice of

operating frequency, switching speeds, and

power dissipation. In many cases, these

Half-Power devices can result in significant power

reduction from an overall system level.

The PAL16’ M series is characterized for

operation over the full military temperature range

of –55°C to 125°C.

更新时间:2025-10-10 16:20:00
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DIP
800
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24+
5000
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8650
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29
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73556
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12245
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14
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DIP
837
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MMI
2402+
CDIP20
8324
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