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LMZ31704RVQR.B中文资料

厂家型号

LMZ31704RVQR.B

文件大小

1297.19Kbytes

页面数量

39

功能描述

LMZ31704 4-A Power Module with 2.95-V to 17-V Input and Current Sharing in QFN Package

数据手册

下载地址一下载地址二到原厂下载

生产厂商

TI2

LMZ31704RVQR.B数据手册规格书PDF详情

1 Features

1• Complete integrated power solution allows

small footprint, low-profile design

• 10-mm × 10-mm × 4.3-mm package

– Pin compatible with LMZ31710 and LMZ31707

• Efficiencies up to 95%

• Eco-mode™ / light load efficiency (LLE)

• Wide-output voltage adjust

0.6 V to 5.5 V, with 1% reference accuracy

• Supports parallel operation for higher current

• Optional split power rail allows

input voltages down to 2.95 V

• Adjustable switching frequency

(200 kHz to 1.2 MHz)

• Synchronizes to an external clock

• Provides 180° out-of-phase clock signal

• Adjustable slow start

• Output voltage sequencing / tracking

• Power good output

• Programmable undervoltage lockout (UVLO)

• Overcurrent and overtemperature protection

• Pre-bias output start-up

• Operating temperature range: –40°C to 85°C

• Enhanced thermal performance: 13.3°C/W

• Meets EN55022 Class B emissions

– Integrated shielded inductor

• Create a custom design using the LMZ31704 with

the WEBENCH® Power Designer

2 Applications

• Broadband and communications infrastructure

• Automated test and medical equipment

• Compact PCI / PCI express / PXI express

• DSP and FPGA point-of-load applications

3 Description

The LMZ31704 power module is an easy-to-use

integrated power solution that combines a 4-A DC/DC

converter with power MOSFETs, a shielded inductor,

and passives into a low profile, QFN package. This

total power solution allows as few as three external

components and eliminates the loop compensation

and magnetics part selection process.

The 10 × 10 × 4.3 mm QFN package is easy to

solder onto a printed circuit board and allows a

compact point-of-load design. Achieves greater than

95% efficiency and excellent power dissipation

capability with a thermal impedance of 13.3°C/W. The

LMZ31704 offers the flexibility and the feature-set of

a discrete point-of-load design and is ideal for

powering a wide range of ICs and systems.

Advanced packaging technology affords a robust and

reliable power solution compatible with standard QFN

mounting and testing techniques.

更新时间:2025-12-2 11:00:00
供应商 型号 品牌 批号 封装 库存 备注 价格
TI/德州仪器
23+
QFN
50000
全新原装正品现货,支持订货
TI/德州仪器
2022+
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6600
TI/德州仪器
21+
BQFN-42
7200
只做原装支持终端
TI/德州仪器
25+
QFN42
58788
百分百原装现货 实单必成 欢迎询价
TI
23+
B3QFN42
8600
受权代理!全新原装现货特价热卖!
TI
三年内
1983
只做原装正品
TI
17+
10000
原装正品
TI
20+
B3QFN42
53650
TI原装主营-可开原型号增税票
TI
20+
B3QFN42
11520
特价全新原装公司现货
TI
24+
QFN42
36500
一级代理/放心采购