位置:LMZ31506RUQR > LMZ31506RUQR详情

LMZ31506RUQR中文资料

厂家型号

LMZ31506RUQR

文件大小

1150.17Kbytes

页面数量

38

功能描述

LMZ31506 6-A Power Module With 2.95-V to 14.5-V Input and Current Sharing in QFN Package

数据手册

原厂下载下载地址一下载地址二到原厂下载

生产厂商

TI2

LMZ31506RUQR数据手册规格书PDF详情

1 Features

1• Complete Integrated Power Solution Allows

Small Footprint, Low-Profile Design

• 9-mm × 15-mm × 2.8-mm package

- Pin Compatible with LMZ31503

• Efficiencies Up To 96%

• Wide-Output Voltage Adjust

0.6 V to 5.5 V, with 1% Reference Accuracy

• Supports Parallel Operation for Higher Current

• Optional Split Power Rail Allows

Input Voltage down to 1.6 V

• Adjustable Switching Frequency

(250 kHz to 780 kHz)

• Synchronizes to an External Clock

• Adjustable Slow-Start

• Output Voltage Sequencing / Tracking

• Power Good Output

• Programmable Undervoltage Lockout (UVLO)

• Output Overcurrent Protection (Hiccup Mode)

• Over-Temperature Protection

• Pre-bias Output Start-up

• Operating Temperature Range: –40°C to 85°C

• Enhanced Thermal Performance: 13°C/W

• Meets EN55022 Class B Emissions

- Integrated Shielded Inductor

• Create a Custom Design Using the LMZ31506

With the WEBENCH® Power Designer

2 Applications

• Broadband & Communications Infrastructure

• Automated Test and Medical Equipment

• Compact PCI, PCI Express and PXI Express

• DSP and FPGA Point of Load Applications

3 Description

The LMZ31506 power module is an easy-to-use

integrated power solution that combines a 6-A DC-to-

DC converter with power MOSFETs, a shielded

inductor, and passives into a low profile, QFN

package. This total power solution allows as few as

three external components and eliminates the loop

compensation and magnetics part selection process.

The 9×15×2.8 mm QFN package is easy to solder

onto a printed circuit board and allows a compact

point-of-load design with greater than 90% efficiency

and excellent power dissipation with a thermal

impedance of 13°C/W junction to ambient. The

device delivers the full 6-A rated output current at

85°C ambient temperature without airflow.

The LMZ31506 offers the flexibility and the featureset

of a discrete point-of-load design and is ideal for

powering performance DSPs and FPGAs. Advanced

packaging technology afford a robust and reliable

power solution compatible with standard QFN

mounting and testing techniques.

更新时间:2025-10-31 20:07:00
供应商 型号 品牌 批号 封装 库存 备注 价格
TI/德州仪器
25+
BQFN47
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TI/德州仪器全新特价LMZ31506RUQR即刻询购立享优惠#长期有货
TI
16+
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全新原装现货供应2
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23+
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原装正品代理渠道价格优势
TI
24+
B1QFN-47
5000
原厂授权代理 价格绝对优势
TI/德州仪器
2021+
BQFN47
9000
原装现货,随时欢迎询价
TI/德州仪器
24+
BQFN47
4500
原装正品,有挂有货,假一赔十
TI(德州仪器)
24+
B1QFN-47
7948
原厂可订货,技术支持,直接渠道。可签保供合同
TI(德州仪器)
24+
B1QFN-47
8336
只做原装现货假一罚十!价格最低!只卖原装现货
TI
2024+
N/A
70000
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TI/德州仪器
25+
B1QFN-47
1246
原装优势公司现货!