1 Features

1• Complete Integrated Power Solution Allows

Small Footprint, Low-Profile Design

• 9 mm × 15mm × 2.8mm package

- Pin Compatible with LMZ31506

• Efficiencies Up To 95%

• Wide-Output Voltage Adjust

0.8 V to 5.5 V, with 1% Reference Accuracy

• Optional Split Power Rail Allows

Input Voltage Down to 1.6 V

• Adjustable Switching Frequency

(330 kHz to 780 kHz)

• Synchronizes to an External Clock

• Adjustable Slow-Start

• Output Voltage Sequencing / Tracking

• Power Good Output

• Programmable Undervoltage Lockout (UVLO)

• Overcurrent Protection (Hiccup-Mode)

• Over Temperature Protection

• Pre-bias Output Start-up

• Operating Temperature Range: –40°C to +85°C

• Enhanced Thermal Performance: 13°C/W

• Meets EN55022 Class B Emissions

- Integrated Shielded Inductor

• Create a Custom Design Using the LMZ31503

With the WEBENCH® Power Designer

2 Applications

• Broadband & Communications Infrastructure

• Automated Test and Medical Equipment

• Compact PCI / PCI Express / PXI Express

• DSP and FPGA Point of Load Applications

• High Density Distributed Power Systems

3 Description

The LMZ31503 power module is an easy-to-use

integrated power solution that combines a 3-A DC/DC

converter with power MOSFETs, a shielded inductor,

and passives into a low profile, QFN package. This

total power solution allows as few as 3 external

components and eliminates the loop compensation

and magnetics design process.

The 9×15×2.8 mm QFN package is easy to solder

onto a printed circuit board and allows a compact

point-of-load design with up to 95% efficiency and

excellent power dissipation with a thermal impedance

of 13°C/W junction to ambient. The device delivers

the full 3-A rated output current at 85°C ambient

temperature without airflow.

The LMZ31503 offers the flexibility and the featureset

of a discrete point-of-load design and is ideal for

powering performance DSPs and FPGAs. Advanced

packaging technology afford a robust and reliable

power solution compatible with standard QFN

mounting and testing techniques.