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LMZ30606_V01中文资料

厂家型号

LMZ30606_V01

文件大小

897.72Kbytes

页面数量

35

功能描述

LMZ30606 6A Power Module with 2.95V-6V Input in QFN Package

数据手册

下载地址一下载地址二到原厂下载

生产厂商

TI2

LMZ30606_V01数据手册规格书PDF详情

1 Features

1• Complete Integrated Power Solution Allows

Small Footprint, Low-Profile Design

• 9mm x 11mm x 2.8mm package

- Pin Compatible with LMZ30602 & LMZ30604

• Efficiencies Up To 96%

• Wide-Output Voltage Adjust

0.8 V to 3.6 V, with ±1% Reference Accuracy

• Adjustable Switching Frequency

(500 kHz to 2 MHz)

• Synchronizes to an External Clock

• Adjustable Slow-Start

• Output Voltage Sequencing / Tracking

• Power Good Output

• Programmable Undervoltage Lockout (UVLO)

• Output Overcurrent Protection

• Over Temperature Protection

• Operating Temperature Range: –40°C to 85°C

• Enhanced Thermal Performance: 12°C/W

• Meets EN55022 Class B Emissions

- Integrated Shielded Inductor

• Create a Custom Design Using the LMZ30606

With the WEBENCH® Power Designer

2 Applications

• Broadband and Communications Infrastructure

• Automated Test and Medical Equipment

• Compact PCI / PCI Express / PXI Express

• DSP and FPGA Point of Load Applications

• High Density Distributed Power Systems

3 Description

The LMZ30606 SIMPLE SWITCHER® power module

is an easy-to-use integrated power solution that

combines a 6-A DC/DC converter with power

MOSFETs, a shielded inductor, and passives into a

low profile, QFN package. This total power solution

requires as few as 3 external components and

eliminates the loop compensation and magnetics part

selection process.

The 9×11×2.8 mm QFN package is easy to solder

onto a printed circuit board and allows a compact

point-of-load design with greater than 90% efficiency

and excellent power dissipation with a thermal

impedance of 12°C/W junction to ambient. The

device delivers the full 6-A rated output current at

85°C ambient temperature without airflow.

The LMZ30606 offers the flexibility and the featureset

of a discrete point-of-load design and is ideal for

powering performance DSPs and FPGAs. Advanced

packaging technology afford a robust and reliable

power solution compatible with standard QFN

mounting and testing techniques.

更新时间:2025-12-23 17:40:00
供应商 型号 品牌 批号 封装 库存 备注 价格
TI
24+
SMD
85450
TI一级代理商原装进口现货
TI
24+
B1QFN39
10000
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TI(德州仪器)
24+
NA/
7350
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TI(德州仪器)
24+
NA/
8735
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TI
23+
NA
6800
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TI(德州仪器)
23+
15000
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TI(德州仪器)
24+
6000
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TI(德州仪器)
2450+
SMD
9850
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TI(德州仪器)
25+
封装
500000
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TI
2016+
B1QFN39
3000
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