1 Features

1• Complete Integrated Power Solution Allows

Small Footprint, Low-Profile Design

• 9 mm × 11 mm × 2.8 mm package

- Pin Compatible with LMZ30604 and LMZ30606

• Efficiencies Up To 96%

• Wide-Output Voltage Adjust

0.8 V to 3.6 V, with ±1% Reference Accuracy

• Adjustable Switching Frequency

(500 kHz to 2 MHz)

• Synchronizes to an External Clock

• Adjustable Slow-Start

• Output Voltage Sequencing / Tracking

• Power Good Output

• Programmable Undervoltage Lockout (UVLO)

• Output Overcurrent Protection

• Over Temperature Protection

• Operating Temperature Range: –40°C to 85°C

• Enhanced Thermal Performance: 12°C/W

• Meets EN55022 Class B Emissions

- Integrated Shielded Inductor

• Create a Custom Design Using the LMZ30602

With the WEBENCH® Power Designer

2 Applications

• Broadband & Communications Infrastructure

• Automated Test and Medical Equipment

• Compact PCI / PCI Express / PXI Express

• DSP and FPGA Point of Load Applications

• High Density Distributed Power Systems

3 Description

The LMZ30602 power module is an easy-to-use

integrated power solution that combines a 2-A DC/DC

converter with power MOSFETs, a shielded inductor,

and passives into a low profile, QFN package. This

total power solution requires as few as 3 external

components and eliminates the loop compensation

and magnetics part selection process.

The 9×11×2.8 mm QFN package is easy to solder

onto a printed circuit board and allows a compact

point-of-load design with greater than 90% efficiency

and excellent power dissipation with a thermal

impedance of 12°C/W junction to ambient. The

device delivers the full 2-A rated output current at

85°C ambient temperature without airflow.

The LMZ30602 offers the flexibility and the featureset

of a discrete point-of-load design and is ideal for

powering performance DSPs and FPGAs. Advanced

packaging technology afford a robust and reliable

power solution compatible with standard QFN

mounting and testing techniques.