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LMV1015UR-25SLASHNOPB.A中文资料

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LMV1015UR-25SLASHNOPB.A

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功能描述

LMV1015 Analog Series: Built-in Gain ICs for High Sensitivity 2-Wire Microphones

数据手册

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简称

TI2德州仪器

生产厂商

Texas Instruments

中文名称

美国德州仪器公司官网

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LMV1015UR-25SLASHNOPB.A数据手册规格书PDF详情

1FEATURES

2• (Typical LMV1015-15, 2.2V supply, RL = 2.2 kΩ,

C = 2.2 μF, V IN = 18 mVPP, unless otherwise

specified)

• Supply Voltage: 2V - 5V

• Supply Current: <180 μA

• Signal to Noise Ratio (A-Weighted): 60 dB

• Output Voltage Noise (A-Weighted): −89 dBV

• Total Harmonic Distortion 0.09%

• Voltage Gain

– LMV1015-15: 15.6 dB

– LMV1015-25: 23.8 dB

• Temperature Range: −40°C to 85°C

• Large Dome 4-Bump DSBGA Package with

Improved Adhesion Technology.

APPLICATIONS

• Cellular Phones

• Headsets

• Mobile Communications

• Automotive Accessories

• PDAs

• Accessory Microphone Products

DESCRIPTION

The LMV1015 is an audio amplifier series for small

form factor electret microphones. This 2-wire portfolio

is designed to replace the JFET amplifier. The

LMV1015 series is ideally suited for applications

requiring high signal integrity in the presence of

ambient or RF noise, such as in cellular

communications. The LMV1015 audio amplifiers are

ensured to operate over a 2.2V to 5.0V supply

voltage range with fixed gains of 15.6 dB and 23.8

dB. The devices offer excellent THD, gain accuracy

and temperature stability as compared to a JFET

microphone.

The LMV1015 series enables a two-pin electret

microphone solution, which provides direct pin-to-pin

compatibility with the existing older JFET market.

Texas Instruments' built-in gain families are offered in extremely thin space saving 4-bump DSBGA

packages (0.3 mm maximum). The LMV1015XR is

designed for 1.0 mm ECM canisters and thicker.

These extremely miniature packages have the Large

Dome Bump (LDB) technology. This DSBGA technology is designed for microphone PCBs

requiring 1 kg adhesion criteria.

更新时间:2025-7-22 11:00:00
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Texas Instruments 美国德州仪器公司

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德州仪器(Texas Instruments),简称TI,是全球领先的半导体公司,为现实世界的信号处理提供创新的数字信号处理(DSP)及模拟器件技术。除半导体业务外,还提供包括传感与控制、教育产品和数字光源处理解决方案。TI总部位于美国德克萨斯州的达拉斯,并在25多个国家设有制造、设计或销售机构。德州仪器是推动互联网时代不断发展的半导体引擎,作为实时技术的领导者,TI正在快速发展,在无线与宽带接入等大型市场及数码相机和数字音频等新兴市场方面,凭借性能卓越的半导体解决方案不断推动着互联网时代的前进步伐。TI预想未来世界的方方面面都渗透着TI产品的点点滴滴,每个电话、每次上网、拍的每张照片、听的每