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LM48861TMSLASHNOPB中文资料

厂家型号

LM48861TMSLASHNOPB

文件大小

403.37Kbytes

页面数量

19

功能描述

LM48861 Ground-Referenced, Ultra Low Noise, Stereo Headphone Amplifier

数据手册

下载地址一下载地址二到原厂下载

生产厂商

TI2

LM48861TMSLASHNOPB数据手册规格书PDF详情

1FEATURES

23• Ground Referenced Outputs – Eliminates

Output Coupling Capacitors

• Common-Mode Sensing

• Advanced Click-and-Pop Suppression

• Low Supply Current

• Minimum External Components

• Micro-Power Shutdown

• ESD Protection of 8kV HBM Contact

• Available in Space-Saving 12-Bump DSBGA

Package

APPLICATIONS

• Mobile Phones

• Portable Electronic Devices

• MP3 Players

KEY SPECIFICATIONS

• Output Power/Channel at

VDD = 1.5V,THD+N = 1%

– R L = 16Ω 12mW (typ)

– RL = 32Ω 13mW (typ)

• Output Power/Channel at

VDD = 1.8V, THD+N = 1%

– RL = 16Ω 24mW (typ)

– RL = 32Ω 22mW (typ)

• Quiescent Power Supply Current at 1.5V

2mA (typ)

• PSRR at 217Hz 83dB (typ)

• Shutdown Current 0.01μA (typ)

DESCRIPTION

The LM48861 is a single supply, ground-referenced

stereo headphone amplifier. Part of TI's PowerWise™

product family, the LM48861 consumes only 3mW of

power, yet still provides great audio performance. The

ground-referenced architecture eliminates the larger

DC blocking capacitors required by traditional

headphone amplifier's saving board space and

reducing cost.

The LM48861 features common-mode sensing that

corrects for any differences between the amplifier

ground and the potential at the headphone return

terminal, minimizing noise created by any ground

mismatches.

The LM48861 delivers 22mW/channel into a 32Ω

load with <1% THD+N with a 1.8V supply. Power

supply requirements allow operation from 1.2V to 2.8V. High power supply rejection ratio (PSRR), 83dB

at 217Hz, allows the device to operate in noisy

environments without additional power supply

conditioning. A low power shutdown mode reduces

supply current consumption to 0.01μA.

Superior click and pop suppression eliminates audible

transients on power-up/down and during shutdown.

The LM48861 is available in an ultra-small 12-bump,

0.4mm pitch, DSBGA package (1.215mm x

1.615mm).

更新时间:2025-10-5 16:00:00
供应商 型号 品牌 批号 封装 库存 备注 价格
NS/TI
17+
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6200
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4500
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3000
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HAR
23+
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5000
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09+
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6000
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24+
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20000
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24+
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9600
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NS/国半
23+
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50000
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NS
23+
BGA
50000
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