1 Features

• Low loss integrated shunt resistor

– Internal resistance: 5mΩ at TA = 25°C

– Current rating: ±6A at TA = 25°C

• High-resolution, 16-bit delta-sigma ADC

– Wide common-mode range: –0.3V to +40V

– Reports current, bus voltage, power, internal

temperature, energy, and charge

– Programmable conversion time and averaging

• Current monitoring accuracy:

– Total Measurement Error: ±0.5% at 1A

– Offset current: ±0.6mA (maximum)

– Gain error: ±0.5% (maximum at 1A)

– Gain error drift: ±50ppm/°C (maximum)

• Power monitoring accuracy:

– 0.85% accuracy at 1A

• Energy and Charge accuracy:

– 1.35% accuracy at 1A

• Internal monitoring and fault detection

• Precision oscillator: ±0.5% (maximum)

• 2.94MHz High-Speed I2C interface with 4 pinselectable

addresses

• Operates from a 2.7V to 5.5V supply

– Operational current: 640μA (typical)

– Shutdown current: 5μA (maximum)

2 Applications

• Notebook computers

• Smartphones

• Industrial battery packs

• Smart network interface cards (NIC)

• Hardware accelerator cards

3 Description

The INA701 is a digital power monitor with an

integrated shunt resistor along with a 16-bit deltasigma

ADC specifically designed for current sensing

applications. The device can measure full-scale

currents up to ±6.225A, over the common-mode

voltage range of –0.3V to +40V.

The INA701 reports current, bus voltage, die

temperature, power, energy and charge accumulation

with a precision ±0.5% integrated oscillator, all

while performing the needed calculations in the

background. The integrated temperature sensor is

±3°C accurate over the junction temperature range.

The low offset and gain error drift of the INA701

allows use in systems that do not undergo

temperature calibration during manufacturing.

The device features selectable ADC conversion

times from 50μs to 4.12ms as well as sample

averaging from 1x to 1024x, which further helps

reduce the noise of the measured data and allows for

optimization of overcurrent detection windows.

The device is available in a tiny PowerWCSP

(DSBGA) package to minimize the solution size and

maximize thermal performance.