1 Features

1• −40°C to +125°C Operating Temperature Range

• >600-Mbps (300-MHz) Switching Rates

• 0.3-ns Typical Differential Skew

• 0.7-ns Maximum Differential Skew

• 3.3-V Power Supply Design

• Low power dissipation (46 mW at 3.3-V Static)

• Flow-Through Design Simplifies PCB Layout

• Power Off Protection (Outputs in High Impedance)

• Conforms to TIA/EIA-644 Standard

• 8-Pin SOIC Package Saves Space

2 Applications

• Board-to-Board Communication

• Test and Measurement

• Motor Drives

• LED Video Walls

• Wireless Infrastructure

• Telecom Infrastructure

• Multi-Function Printers

• NIC Cards

• Rack Servers

• Ultrasound Scanners

3 Description

The DS90LV027AH is a dual LVDS driver device

optimized for high data rate and low power

applications. The device is designed to support data

rates in excess of 600Mbps (300MHz) utilizing Low

Voltage Differential Signaling (LVDS) technology. The

DS90LV027AH is a current mode driver allowing

power dissipation to remain low even at high

frequency. In addition, the short circuit fault current is

also minimized.

The device is in a 8-lead SOIC package. The

DS90LV027AH has a flow-through design for easy

PCB layout. The differential driver outputs provides

low EMI with its typical low output swing of 360 mV. It

is perfect for high speed transfer of clock and data.

The DS90LV027AH can be paired with its companion

dual line receiver, the DS90LV028AH, or with any of

TI's LVDS receivers, to provide a high-speed point-topoint

LVDS interface.