FEATURES

400-MSPS Update Rate

LVDS-Compatible Input Interface

Spurious Free Dynamic Range (SFDR) to

Nyquist

− 69 dBc at 70-MHz IF, 400 MSPS

W-CDMA Adjacent Channel Power Ratio

ACPR

− 73 dBc at 30.72-MHz IF, 122.88 MSPS

− 71 dBc at 61.44-MHz IF, 245.76 MSPS

Differential Scalable Current Outputs: 2 mA to

20 mA

On-Chip 1.2-V Reference

Single 3.3-V Supply Operation

Power Dissipation: 820 at fclk = 400 MSPS,

fout = 70 MHz

Package: 48-Pin HTQFP PowerPad,

TJA = 28.8°C/W

APPLICATIONS

Cellular Base Transceiver Station Transmit

Channel

− CDMA: WCDMA, CDMA2000, IS−95

− TDMA: GSM, IS−136, EDGE/GPRS

− Supports Single-Carrier and Multicarrier

Applications

Test and Measurement: Arbitrary Waveform

Generation

Direct Digital Synthesis (DDS)

Cable Modem Headend

DESCRIPTION

The DAC5675 is a 14-bit resolution high-speed

digital-to-analog converter. The DAC5675 is designed

for high-speed digital data transmission in wired and

wireless communication systems, high-frequency

direct-digital synthesis (DDS), and waveform

reconstruction in test and measurement applications.

The DAC5675 has excellent spurious free dynamic

range (SFDR) at high intermediate frequencies, which

makes the DAC5675 well suited for multicarrier

transmission in TDMA and CDMA based cellular base

transceiver stations BTS.

The DAC5675 operates from a single-supply voltage of

3.3 V. Power dissipation is 820 mW at fclk = 400 MSPS,

fout = 70 MHz. The DAC5675 provides a nominal

full-scale differential current output of 20 mA,

supporting both single-ended and differential

applications. The output current can be directly fed to

the load with no additional external output buffer

required. The output is referred to the analog supply

voltage AVDD.

The DAC5675 is manufactured on Texas Instruments

advanced high-speed mixed-signal BiCMOS process.

The DAC5675 comprises a LVDS (low-voltage

differential signaling) interface. LVDS features a low

differential voltage swing with a low constant power

consumption across frequency, allowing for high speed

data transmission with low noise levels, i.e., low

electromagnetic interference (EMI). LVDS is typically

implemented in low-voltage digital CMOS processes,

making it the ideal technology for high-speed interfacing

between the DAC5675 and high-speed low-voltage

CMOS ASICs or FPGAs. The DAC5675 currentsource-

array architecture supports update rates of up to

400 MSPS. On-chip edge-triggered input latches

provide for minimum setup and hold times thereby

relaxing interface timing.