1 Features

• Low resistance

• Small footprint 1.2 mm × 1.2 mm

• Low profile 0.36-mm height

• Lead free

• Gate-source voltage clamp

• Gate ESD protection

• RoHS compliant

• Halogen free

2 Applications

• Battery management

• Load switch

• Battery protection

3 Description

This –8-V, 8.2-mΩ, 1.2-mm × 1.2-mm Land Grid

Array (LGA) NexFET™ device has been designed to

deliver the lowest on-resistance and gate charge in

the smallest outline possible with excellent thermal

characteristics in an ultra-low profile. The Land Grid

Array (LGA) package is a silicon chip scale package

with metal pads instead of solder balls.