1 Features

Processor Cores:

• Dual or Quad-core Arm® Cortex® R5F CPU with

each core running up to 1GHz

– 32KB I-Cache with 64-bit ECC per CPU core

• 4x8KB association

• Single Error Correction, Double Error

Detection ECC protected per 64 bits

– 32KB D-cache with 64-bit ECC per CPU core

• 4x8KB association

• Single Error Correction, Double Error

Detection ECC protected per 64 bits

– 64KB Tightly Coupled Memory (TCM) per core,

with 32-bit ECC

• Single Error Correction, Double Error

Detection ECC protected per 64 bits

• Two Banks, A and B, 32KB each

– Bank B split into B0 and B1, 16KB each

• 128KB TCM for CPU0 in lockstep mode

– Up to 128KB Remote L2 Cache

• 32B cache line

• Up to 128KB L2 cache covering up to 16MB

cacheable space

• Read only, 8-way cache

• Fast Local Copy (FLC) support

– For each cluster, lockstep or independent dual

core operation supported

• Single or Dual C7x DSP core with each core

running up to 1GHz

– L1 memory architecture

• 32KB I-Cache per core

• 64KB D-Cache per core

– L2 memory architecture

• 2.25MB with ECC protection on L2 SRAM

– 2MB Main segment

– 256KB Auxiliary segment

– Matrix Multiply Accelerator Version 2f (MMA2F)

on DSP0

• 2x Asynchronous Audio Sample Rate Converter

(ASRC)

– 140dB Signal-to-Noise ratio (SNR)

– Up to 8 pairs of input and output streams (up to

16 channels total) per ASRC

– Input and output sample rates from 8KHz to

216KHz

– 16-, 18-, 20-, 24-bit data input/output

Memory Subsystem:

• Up to 6MB of On-Chip Shared SRAM

• Remote Low latency L2 cache (RL2), software

programmable, allocated from SRAM

• 432KB of On-Chip SRAM in SMS Subsystem

– 256KB of On-Chip RAM with SECDED ECC in

SMS Subsystem

– 176KB of On-Chip RAM with SECDED ECC in

SMS Subsystem for TI security firmware

Flash and Memory Interfaces:

• 2 × Flash Sub Systems (FSS) that support Octal

Serial Peripheral Interface (OSPI) at up to 166MHz

SDR and 166MHz DDR at 1.8V and 3.3V with full

XIP (eXecute In Place) which can be used for

– 1x FSS supporting OSPI OptiFlash memory

technology, Firmware Over-The-Air upgrades

(FOTA), and On The Fly Advanced Encryption

Standard (OTFA)

– 1x FSS supporting OSPI or HyperRAM

– RAM expansion

• 1 × 8-bit Multi-Media Card/Secure Digital

(eMMC/SD) interface

General Connectivity:

• 5 × Multichannel Audio Serial Ports (McASP)

– Transmit and Receive Clocks up to 50MHz

– Up to 26 Serial Data Pins across 5x McASP

with Independent TX and RX Clocks

– Supports Time Division Multiplexing (TDM),

Inter-IC Sound (I2S) and Similar Formats

– Supports Digital Audio Interface Transmission

(SPDIF, IEC60958-1, and AES-3 Formats)

– FIFO Buffers for Transmit and Receive (256

Bytes)

– Support for audio reference output clock

• 8 × Universal Asynchronous RX-TX (UART)

modules

• 5 × Serial Peripheral Interface (SPI) controllers

• 8 × Inter-Integrated Circuit (I2C) ports

• 5 × Modular Controller Area Network (MCAN)

modules with CAN-FD support

• 3 × Enhanced Pulse Width Modulation (ePWM)

modules

• 6 × Enhanced Capture (ECAP) modules

• 1 × 12-bit Analog to Digital Converters (ADC) with

4MSPS maximum sampling rate

• Up to 167 General Purpose I/O (GPIO)

High Speed Interfaces

• Integrated Ethernet Switch supporting (total 2

external ports)

– RMII (10/100) or RGMII (10/100/1000)

– IEEE 1588 (Annex D, Annex E, Annex F with

802.1AS PTP)

– Supports 802.1Qav (eAVB)

– Clause 45 MDIO PHY management

– Packet Classifier based on ALE engine with

512 classifiers

– Priority flow control

– Four CPU hardware interrupt pacing

– IP/ UDP/ TCP checksum offload in hardware

• USB 2.0

– Port configurable as USB host, USB device, or

USB Dual-Role device

– Integrated USB VBUS detection

Security:

• Hardware Security Module (HSM)

– Dedicated dual-core ARM Cortex-M4F Security

co-processor with dedicated interconnect for

security

– Dedicated security DMA and IPC subsystem for

isolated processing

• Secure boot support

– Hardware-enforced Root-of-Trust (RoT)

– Support to switch RoT via backup key

– Support for takeover protection, IP protection,

and anti-roll back protection

• Cryptographic acceleration supported

– Session-aware cryptographic engine with ability

to auto-switch key-material based on incoming

data stream

– Supports cryptographic cores

• AES - 128/192/256-bit key sizes

• SHA2 - 224/256/384/512-bit support

• DRBG with true random number generator

• PKA (Public Key Accelerator) to Assist

in RSA/ECC processing: RSA-4096 bits,

ECDSA, SM2DSA, Curve25519/448

• Supports Chinese crypto algorithms: SM3

and SM4

– DMA support

• Debugging security

– Secure software controlled debug access

– Security aware debugging

• Trusted Execution Environment (TEE) supported

– Arm TrustZone® based TEE

– Extensive firewall support for isolation

– Secure watchdog/timer/IPC

• Secure storage support

• On-the-Fly encryption and support for OSPI

interface in XIP mode

Functional Safety:

• Functional Safety-Compliant targeted [Automotive]

– Developed for functional safety applications

– Documentation to be made available to aid ISO

26262 functional safety system design

– Systematic capability up to ASIL-D targeted

– Hardware integrity up to ASIL-B targeted

– Safety-related certification

• ISO 26262 planned

Power Management:

• Power modes supported by Device Manager:

– Active

– Standby

– IO Retention

Boot Options:

• UART

• I2C EEPROM

• OSPI NOR/NAND Flash

• SD Card

• eMMC

• USB (host) Mass Storage

• USB (device) boot from external host (DFU mode)

• Ethernet

Technology / Package:

• AEC-Q100 qualified for automotive applications

• 16-nm FinFET technology

• 15.8mm x 15.8mm, 0.8mm pitch 361-pin FCCSP

2 Applications

• Automotive:

– Premium Audio

– Audio Amplifiers

– Audio Gateway

– AVAS - Acoustic Vehicle Alert System

– Active/Road Noise Cancellation

– Digital Cockpit

3 Description

The AM275x family of highly-integrated, high-performance microcontrollers is based on the Arm® Cortex R5F

and C7x floating point DSP cores. The microcontrollers enable original equipment manufacturers (OEM) and

original design manufacturers (ODM) to quickly bring to market devices with robust software support and rich

user interfaces. The device offers the maximum flexibility of a fully integrated, mixed processor design

Key features and benefits:

• Extensive audio interfacing with 5x McASP peripherals

• Peripherals supporting system level connectivity such as 2-port Gigabit Ethernet, USB, OSPI/QSPI, CAN-FD,

UARTs, SPI and GPIOs.

• Supports the latest cybersecurity requirements with the built-in Hardware Security Module (HSM).

• One or two dual-core R5F clusters with 128KB TCM per cluster (64KB per core) and up to two C7x DSP

cores with 2.25MB of L2 SRAM per C7x DSP, greatly reducing the need for external memory.