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AM261X数据手册规格书PDF详情
1 Features
Processor Cores:
• Single and Dual Arm® Cortex® R5F CPU with each
core running up to 500MHz
– 16KB I-Cache with 64-bit ECC per CPU core
– 16KB D-cache with 32-bit ECC per CPU core
– 256KB Tightly Coupled Memory (TCM) with 32-
bit ECC per core
– Lockstep or Dual-core operation supported
• Trigonometric Math Unit (TMU) for accelerating
trigonometric functions
– Up to 2x, one per R5F MCU core
Memory:
• 1.5MB of On-Chip Shared RAM (OCSRAM):
– 3 banks × 512KB
– ECC error protection for full 1.5MB OCSRAM
– Remote L2 Cache (RL2) for external memory,
software programmable up to 256KB per CPU
core
• 2x Octal Serial Peripheral Interface (OSPI) up to
133MHz SDR and DDR
– 1x with eXecute In Place (XIP) support
– RAM expansion/Flash over the Air (FOTA)
• General-Purpose Memory Controller (GPMC)
– 16-bit parallel data bus with 22-bit address bus
and 4 chip selects
– Up to 4MB addressable memory space
– Integrated Error Location Module (ELM)
support for error checking
System on Chip (SoC) Services and Architecture:
• 1x EDMA to support data movement functions
• Device Boot supported from the following
interfaces:
– UART (Primary/Backup)
– OSPI NOR and NAND Flash (50MHz SDR and
25MHz DDR) (Primary)
– USB Peripheral boot
• Interprocessor communication modules
– SPINLOCK module for synchronizing
processes running on multiple cores
– MAILBOX functionality implemented through
CTRLMMR registers
• Central Platform Time Sync (CPTS) support with
time-sync and compare-event interrupt routers
• Timer Modules:
– 2x Windowed Watchdog Timer (WWDT)
– 4x Real Time Interrupt (RTI) timer
USB 2.0
• Port configurable as USB host, USB device, or
USB Dual-Role device
• USB 2.0 Host mode
– High-Speed (HS, 480Mbps)
– Full-Speed (FS, 12Mbps)
– Low-Speed (LS, 1.5Mbps)
• USB 2.0 Device mode
– High-Speed (HS, 480Mbps)
– Full-Speed (FS, 12Mbps)
Industrial Connectivity:
• 2x Programmable Real-time Unit – Industrial
Communication Subsystem (PRU-ICSS)
– Dual core Programmable Realtime Unit
Subsystem (PRU0 / PRU1) per PRU-ICSS for
4 cores total
• Deterministic hardware
• Dynamic firmware
– 20-channel enhanced input (eGPI) per PRU
– 20-channel enhanced output (eGPO) per PRU
– Embedded Peripherals and Memory
• 1x UART, 1x ECAP, 1x MDIO, 1x IEP
• 1x 32KB Shared General Purpose RAM
• 2x 8KB Shared Data RAM
• 1x 12KB IRAM per PRU
• ScratchPad (SPAD), MAC/CRC
– Digital encoder and sigma-delta control loops
– The PRU-ICSS enables advanced industrial
protocols including:
• EtherCAT®, Ethernet/IP™
• PROFINET®, IO-Link®
– Dedicated Interrupt Controller (INTC)
– Dynamic CONTROLSS XBAR Integration
High Speed Interfaces
• Integrated 3-port Gigabit Ethernet Switch (CPSW)
supporting up to two external ports
– Selectable MII (10/100), RMII (10/100), or
RGMII (10/100/1000)
– IEEE 1588 (2008 Annex D, Annex E, Annex F)
with 802.1AS PTP
– Clause 45 MDIO PHY management
– 512x ALE engine based packet classifiers
– Priority flow control with up to 2KB packet size
– Four CPU hardware interrupt pacing
– IP/ UDP/ TCP checksum offload in hardware
– Time Sensitive Network (TSN) Support
– Cut-thru switching and Interexpress Traffic
(IET) support
General Connectivity:
• 6x Universal Asynchronous RX-TX (UART)
• 4x Serial Peripheral Interface (SPI) controllers
• 3x Local Interconnect Network (LIN) ports
• 3x Inter-Integrated Circuit (I2C) ports
• 2x Modular Controller Area Network (MCAN)
modules with CAN-FD support
• 1x Fast Serial Interface Transmitter (FSITX)
• 1x Fast Serial Interface Receiver (FSIRX)
• Up to 141x General Purpose I/O (GPIO) pins
Sensing and Actuation:
• Real-time Control Subsystem (CONTROLSS)
• Flexible Input/Output Crossbars (XBAR)
• 3x 12-bit Analog to Digital Converters (ADC) with 3
MSPS maximum sampling rate
– Each ADC module with
• 7x Single ended channels OR
• 3x Differential channels
– Highly configurable ADC digital logic
• With selectable internal or external
reference
• 4x Post-Processing blocks for each ADC
module
• 9x Analog Comparators with internal 12-bit DAC
reference (CMPSSA)
• 1x 12 bit Digital to Analog Converter (DAC)
• 10x Enhanced High Resolution Pulse Width
Modulation (eHRPWM) modules
– Single or Dual PWM channels
– Advanced PWM Configurations
– Enhanced HRPWM time resolution
• 8x Enhanced Capture (ECAP) modules
• 2x Enhanced Quadrature Encoder Pulse (EQEP)
modules
• 2x Sigma-Delta Filter Modules (SDFM)
Data Storage
• 1 × 4-bit Multi-Media Card/Secure Digital
(MMC/SD) interface
Security:
• Hardware Security Module (HSM) with support for
Auto SHE 1.1/EVITA
• Targeted for ISO 21434 compliance
• Secure boot support
– Device Take Over Protection
– Hardware enforced root-of-trust
– Authenticated boot
– SW Anti-rollback protection
• Debug security
– Secure device debug only after proper
authentication
– Ability to disable device debug functionality
• Device ID and Key Management
– Support for OTP Memory (FUSEROM)
• Store root keys and other security fields
– Separate EFUSE controllers and FUSE ROMs
– Unique Device Public Identifiers
• Memory Protection Units (MPU)
– Dedicated Arm® MPU per Cortex®-R5F core
– System MPU - present at various interfaces in
the SoC (MPU or Firewall)
– 8 to 16 Programmable Regions
• Enable/Privilege ID
• Start/End Address
• Read/Write/Cachable
• Secure/Non-Secure
• Cryptographic acceleration
– Cryptographic cores with DMA Support
– AES - 128/192/256-bit key sizes
– SHA2 - 256/384/512-bit support
– DRBG with pseudo and true random number
generator
Functional Safety:
• Enables design of systems with functional safety
requirements
– Error Signaling Module (ESM)
– ECC or parity on calculation critical memories
– Built-In Self-Test (BIST) on-chip RAM
– Runtime internal diagnostic modules including
voltage, temperature, and clock monitoring,
windowed watchdog timers, CRC engines for
memory integrity checks
• Functional Safety-Compliant [Industrial]
– Developed for functional safety applications
– Documentation to be made available to aid IEC
61508 functional safety system design
– Systematic capability up to SIL-3
– Hardware integrity up to SIL-3
– Safety-related certification
• IEC 61508 certified
• Functional Safety-Compliant [Automotive]
– Developed for functional safety applications
– Documentation to be made available to aid ISO
26262 functional safety system design
– Systematic capability up to ASIL-D
– Hardware integrity up to ASIL-D
– Safety-related certification
• ISO 26262 certified
Technology / Package:
• AEC-Q100 qualified for automotive applications
• ZCZ Package
– 324-pin NFBGAs
– 15.00mm × 15.00mm
– 0.8mm pitch
• ZFG Package
– 304-pin NFBGA
– 13.25mm × 13.25mm
– 0.65mm pitch
• ZEJ Package
– 256-pin NFBGA
– 13.00mm × 13.00mm
– 0.8mm pitch
• ZNC Package
– 293-pin NFBGA
– 10.00mm × 10.00mm
– 0.5mm pitch
2 Applications
• AC Inverter
• Automotive Digital Power Conversion/Control
– Battery Management Systems (BMS)
– On-board Chargers, DC/DC Converters
• Humanoid robot
• Industrial and collaborative robot
• Industrial Digital Power Control
– Energy storage systems
– EV charging
– String Inverters
• Mobile robot
• PLC, DCS and PAC
– Communication Module
– Digital input module
– Digital output module
– Stand-alone remote IO
• Remote I/O
• Single and multiaxis servo drives
• Telematics Control Unit
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
25+ |
2700 |
全新原装自家现货优势! |
|||||
AMD |
25+ |
DIP |
18000 |
原厂直接发货进口原装 |
|||
AMD |
23+ |
DIP |
5000 |
原厂授权代理,海外优势订货渠道。可提供大量库存,详 |
|||
TI |
24+ |
SOP-14 |
3500 |
原装现货,可开13%税票 |
|||
TI |
2023+ |
SOP-14 |
50000 |
原装现货 |
|||
ANALOGIC |
23+ |
WLCSP |
6500 |
专注配单,只做原装进口现货 |
|||
ANALOGIC |
25+ |
WLCSP |
8000 |
原装正品,欢迎来电咨询! |
|||
TI德州仪器 |
22+ |
24000 |
原装正品现货,实单可谈,量大价优 |
||||
24+ |
N/A |
61000 |
一级代理-主营优势-实惠价格-不悔选择 |
||||
TI/德州仪器 |
25+ |
原厂封装 |
10280 |
原厂授权代理,专注军工、汽车、医疗、工业、新能源! |
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