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74AC16244DGGR.A中文资料

厂家型号

74AC16244DGGR.A

文件大小

485.57Kbytes

页面数量

15

功能描述

16-BIT BUFFERS/LINE DRIVERS WITH 3-STATE OUTPUTS

数据手册

下载地址一下载地址二到原厂下载

生产厂商

TI2

74AC16244DGGR.A数据手册规格书PDF详情

Members of the Texas Instruments

Widebus Family

3-State Outputs Drive Bus Lines or Buffer

Memory Address Registers

Flow-Through Architecture Optimizes PCB

Layout

Distributed VCC and GND Configuration

Minimizes High-Speed Switching Noise

EPIC  (Enhanced-Performance Implanted

CMOS) 1-m Process

500-mA Typical Latch-Up Immunity at

125°C

Package Options Include Plastic 300-mil

Shrink Small-Outline (DL) and Thin Shrink

Small-Outline (DGG) Packages Using 25-mil

Center-to-Center Pin Spacings, and 380-mil

Fine-Pitch Ceramic Flat (WD) Packages

Using 25-mil Center-to-Center Pin Spacings

description

The ’AC16244 are 16-bit buffers/line drivers

designed specifically to improve both the

performance and density of 3-state memory

address drivers, clock drivers, and bus-oriented

receivers and transmitters. They can be used as

four 4-bit buffers, two 8-bit buffers, or one 16-bit

buffer. These devices provide true outputs and

symmetrical active-low output-enable (OE)

inputs. When OE is low, the device passes

noninverted data from the A inputs to the Y

outputs. When OE is high, the outputs are in the

high-impedance state.

The 74AC16244 is packaged in the TI’s shrink small-outline package, which provides twice the I/O pin count

and functionality of standard small-outline packages in the same printed-circuit-board area.

The 54AC16244 is characterized for operation over the full military temperature range of –55°C to 125°C. The

74AC16244 is characterized for operation from –40°C to 85°C.

更新时间:2025-10-7 15:14:00
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