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1 Features
• AEC-Q100 qualified for automotive applications
– Temperature grade 1: –40°C to +125°C, TA
• Functional Safety Quality-Managed
– Documentation available to aid in functional
safety system design
• Core
– Arm® 32-bit Cortex®-M0+ CPU, frequency up to
32 MHz
• Operating characteristics
– Wide supply voltage range: 1.62 V to 3.6 V
• Memories
– Up to 64KB of flash
– Up to 4KB of SRAM
• High-performance analog peripherals
– One 12-bit 1.68-Msps analog-to-digital
converter (ADC) with up to 10 total external
channels
– Configurable 1.4-V or 2.5-V internal ADC
voltage reference (VREF)
– Two zero-drift, zero-crossover chopper
operational amplifiers (OPA)
• 0.5-μV/°C drift with chopping
• Integrated programmable gain stage (1-32x)
– One general-purpose amplifier (GPAMP)
– One high-speed comparator (COMP) with 8-bit
reference DAC
• 32-ns propagation delay
• Low power mode down to <1-μA
– Programmable analog connections between
ADC, OPAs, COMP, and DAC
– Integrated temperature sensor
• Optimized low-power modes
– RUN: 71 μA/MHz (CoreMark)
– STOP: 151 μA at 4 MHz and 44 μA at 32 kHz
– STANDBY: 1.0 μA with 32-kHz 16-bit timer
running, SRAM/registers fully retained, and
32MHz clock wakeup in 3.2μs
– SHUTDOWN: 61 nA with IO wakeup capability
• Intelligent digital peripherals
– 3-channel DMA controller
– 3-channel event fabric signaling system
– Four 16-bit general-purpose timers, each with
two capture/compare registers supporting lowpower
operation in STANDBY mode, supporting
a total of 8 PWM channels
– Windowed watchdog timer
• Enhanced communication interfaces
– Two UART interfaces; one supporting LIN,
IrDA, DALI, Smart Card, Manchester and both
supporting low-power operation in STANDBY
– Two I2C interfaces; one supporting FM+ (1
Mbit/s) and both supporting SMBus, PMBus,
and wakeup from STOP
– One SPI supporting up to 16 Mbit/s
• Clock system
– Internal 4- to 32-MHz oscillator with ±1.2
accuracy (SYSOSC)
– Internal 32-kHz low-frequency oscillator with
±3 accuracy (LFOSC)
• Data integrity
– Cyclic redundancy checker (CRC-16 or
CRC-32)
• Flexible I/O features
– Up to 28 GPIOs
– Two 5-V-tolerant open-drain IOs with fail-safe
protection
• Development support
– 2-pin serial wire debug (SWD)
• Package options
– 32-pin VQFN (RHB)
– 32-pin VSSOP (DGS)
– 28-pin VSSOP (DGS)
– 24-pin VQFN (RGE)
– 20-pin VSSOP (DGS)
– 16-pin SOT(DYY)
• Family members (also see Device Comparison)
– MSPM0L1304: 16KB of flash, 2KB of RAM
– MSPM0L1305: 32KB of flash, 4KB of RAM
– MSPM0L1306: 64KB of flash, 4KB of RAM
• Development kits and software (also see Tools
and Software)
– LP-MSPM0L1306 LaunchPad™ development
kit
– MSP Software Development Kit (SDK)
2 Applications
• Automotive body electronics and Lighting
• Automotive Gateway
• Steering Wheel Systems
• Automotive Motor Control
• DC to AC Inverters
• Automotive Interior Lighting
• Door handle modules
• Kick to open modules
• Vehicle Occupancy Detection
• Seat Comfort Module
3 Description
MSPM0L130x microcontrollers (MCUs) are part of the MSP highly-integrated, ultra-low-power 32-bit MSPM0
MCU family based on the enhanced Arm® Cortex®-M0+ core platform operating at up to 32-MHz frequency.
These cost-optimized MCUs offer high-performance analog peripheral integration, support extended temperature
ranges from -40°C to 125°C, and operate with supply voltages ranging from 1.62 V to 3.6 V.
The MSPM0L130x devices provide up to 64KB embedded flash program memory with up to 4KB SRAM. These
MCUs incorporate a high-speed on-chip oscillator with an accuracy up to ±1.2, eliminating the need for an
external crystal. Additional features include a 3-channel DMA, 16- and 32-bit CRC accelerator, and a variety
of high-performance analog peripherals such as one 12-bit 1.68-MSPS ADC with configurable internal voltage
reference, one high-speed comparator with built-in reference DAC, two zero-drift zero-crossover operational
amplifiers with programmable gain, one general-purpose amplifier, and an on-chip temperature sensor. These
devices also offer intelligent digital peripherals such as four 16-bit general purpose timers, one windowed
watchdog timer, and a variety of communication peripherals including two UARTs, one SPI, and two I2Cs. These
communication peripherals offer protocol support for LIN, IrDA, DALI, Manchester, Smart Card, SMBus, and
PMBus.
The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of analog and digital
integration allowing for customers find the MCU that meets their project's needs. The architecture combined
with extensive low-power modes are optimized to achieve extended battery life in portable measurement
applications.
MSPM0L130x MCUs are supported by an extensive hardware and software ecosystem with reference designs
and code examples to get the design started quickly. Development kits include a LaunchPad™ development
kit available for purchase and design files for a target-socket board. TI also provides a free MSP Software
Development Kit (SDK), which is available as a component of Code Composer Studio™ IDE desktop and cloud
version within the TI Resource Explorer. MSPM0 MCUs are also supported by extensive online collateral,
training with MSP Academy, and online support through the TI E2E™ support forums.
For complete module descriptions, see the MSPM0 L-Series 32-MHz Microcontrollers Technical Reference
Manual.
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
MIMIX |
三年内 |
1983 |
纳立只做原装正品13590203865 |
||||
M/A-COM |
22+ |
36000 |
原装现货假一赔十 |
||||
MIMIX |
23+ |
11200 |
原厂授权一级代理、全球订货优势渠道、可提供一站式BO |
||||
M/A-COM |
2018+ |
SMD |
15 |
“芯达集团”专营军工百分之百原装进口 |
|||
M/A-COM |
专业军工 |
NA |
1000 |
只做原装正品军工级部分订货 |
|||
MACOM |
20+ |
NA |
1000 |
全新原装现货,一片也是批量价。 |
|||
10 |
优势库存,全新原装 |
||||||
MACOM |
2023+ |
NA |
80000 |
一级代理/分销渠道价格优势 十年芯程一路只做原装正品 |
|||
M/A-COM |
专业军工 |
NA |
1000 |
只做原装正品 |
|||
MACOM |
22+ |
NA |
1000 |
只做原装,价格优惠,长期供货。 |
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Texas Instruments(TI) 德州仪器 (TI)
德州仪器(Texas Instruments),简称TI,是全球领先的半导体公司,为现实世界的信号处理提供创新的数字信号处理(DSP)及模拟器件技术。除半导体业务外,还提供包括传感与控制、教育产品和数字光源处理解决方案。TI总部位于美国德克萨斯州的达拉斯,并在25多个国家设有制造、设计或销售机构。德州仪器是推动互联网时代不断发展的半导体引擎,作为实时技术的领导者,TI正在快速发展,在无线与宽带接入等大型市场及数码相机和数字音频等新兴市场方面,凭借性能卓越的半导体解决方案不断推动着互联网时代的前进步伐。TI预想未来世界的方方面面都渗透着TI产品的点点滴滴,每个电话、每次上网、拍的每张照片、听的每